FPGA Market

XCZU6EG-2FFVC900I

AMD XilinxZynq UltraScale+ MPSoCFPGA

Part details

Manufacturer
AMD Xilinx
Part number
XCZU6EG-2FFVC900I
Base device
XCZU6EG
Family
Zynq UltraScale+ MPSoC
Package
FFVC900
Package type
BGA
Pin / ball count
900
Speed grade
-2
Temperature grade
Industrial

Device specifications

System Logic Cells
469,000
DSP slices
1,973
Block RAM
32,768 Kb
Transceivers
24
Max transceiver rate
16.3 Gb/s
User I/O (FFVC900)
207
Processor
Quad-core Arm Cortex-A53 MPCore™ up to 1.5 GHz

Part number breakdown

SegmentFieldMeaning
XCZU6EGBase DeviceZynq UltraScale+ MPSoC device XCZU6EG
2Speed GradeSpeed grade 2
FFVC900Package900-pin BGA (flip-chip ball grid array)
ITemperature GradeIndustrial

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XCZU6EG-1FFVB1156CSame device, different packageFFVB1156-1Commercial
XCZU6EG-1FFVB1156ISame device, different packageFFVB1156-1Industrial
XCZU6EG-1FFVB1156ESame device, different packageFFVB1156-1Extended
XCZU6EG-2FFVB1156CSame device, different packageFFVB1156-2Commercial
XCZU6EG-2FFVB1156ISame device, different packageFFVB1156-2Industrial
XCZU6EG-2FFVB1156ESame device, different packageFFVB1156-2Extended
XCZU6EG-3FFVB1156CSame device, different packageFFVB1156-3Commercial
XCZU6EG-1FFVC900CSame device, different speed and temperature gradeFFVC900-1Commercial
XCZU6EG-1FFVC900ISame device, different speed gradeFFVC900-1Industrial
XCZU6EG-1FFVC900ESame device, different speed and temperature gradeFFVC900-1Extended
XCZU6EG-2FFVC900CSame device, commercial temperatureFFVC900-2Commercial
XCZU6EG-2FFVC900ESame device, extended temperatureFFVC900-2Extended
XCZU6EG-3FFVC900CSame device, different speed and temperature gradeFFVC900-3Commercial

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