FPGA Market

How to read a Xilinx part number

An AMD Xilinx ordering code packs five separate decisions into one string: which product line, which silicon, how fast it is binned, what it is packaged in, and what temperature range it is rated to. Read in the right order it is unambiguous. Read left to right it is not, and a misread costs you a part that does not fit the footprint.

The tables on this page are the same lookup tables FPGA Market uses to decode part numbers across the catalogue, published in full.

Anatomy of an ordering code

XC
Prefix
Standard product line
7Z007S
Base device
Zynq-7000, device 007S
-
1L
Speed
Speed grade 1, low voltage
CLG225
Package
225-ball CSP, Pb-free
C
Temp
Commercial grade

XC7Z007S-1LCLG225C — a Zynq-7000 device, speed grade 1L, in a 225-ball Pb-free chip-scale BGA, commercial temperature.

Read it from both ends, not left to right

The suffix has no separators, so the only reliable method is to take the ends first and let the middle fall out:

  1. 1. Front — the prefix. Two or three letters. XC is the standard line; XA, XQ and XQR mark automotive, defense and space qualification.
  2. 2. Back — the temperature letter. The single trailing letter after the last run of digits.
  3. 3. Back again — the ball count. The last run of digits in the string. Two to four digits.
  4. 4. Front again — the base device. Everything between the prefix and the hyphen.
  5. 5. What is left is the speed grade and the package letters, run together — and splitting those two is the only genuinely hard step.

The speed grade / package boundary

Take XC6SLX100-1LFGG676C. After the ball count and temperature letter come off, you are holding 1LFGG. There are two readings:

ReadingSpeedPackageCorrect?
1 + LFGG6761LFGG676No — LFGG is not a Xilinx package designator
1L + FGG6761LFGG676Yes — fine-pitch BGA, Pb-free, low-voltage speed grade

Nothing in the string marks the boundary. The rule that resolves it is: the package designator must be one that actually exists. Match the longest real designator that ends the run, and whatever precedes it is the speed grade. A speed grade is one or two digits plus at most one letter — the L for low voltage, occasionally M. If what is left over does not fit that shape, the split is wrong.

This is also why we would rather decode part of a code than all of it. Where a designator is not one we can verify — a newer or rarer package — the base device, ball count and temperature grade are still unambiguous and are shown, and the speed/package split is left alone rather than guessed at.

Worked examples

XC4VFX100-10FF1152C
XCStandard product line
4VFX100Virtex-4 FX, device 100
10Speed grade 10
FF11521152-ball flip-chip BGA
CCommercial

Older families number speed grades 10, 11, 12 rather than 1, 2, 3. A two-digit speed grade is normal on Virtex-4 and earlier — it is not a package code.

XC6SLX100-1LFGG676C
XCStandard product line
6SLX100Spartan-6 LX, device 100
1LSpeed grade 1, low-voltage
FGG676676-ball fine-pitch BGA, Pb-free
CCommercial

The L belongs to the speed grade, not the package. This is the single most common misreading — see the boundary rule below.

XCZU11EG-1FFVB1517I
XCStandard product line
ZU11EGZynq UltraScale+ MPSoC, EG device
1Speed grade 1
FFVB15171517-ball flip-chip BGA
IIndustrial

UltraScale+ package designators are four letters, not two. The EG/EV/CG suffix on the device is the processing-system tier, not a package or grade.

XA7A35T-1CPG236Q
XAAutomotive, AEC-Q100 qualified
7A35TArtix-7, 35T
1Speed grade 1
CPG236236-ball chip-scale BGA, Pb-free
QAutomotive Q-grade

The qualification is carried twice: XA at the front and Q at the end. An XC part with the same device and package is not an automotive part and is not interchangeable with one.

XQ7Z020-CL484
XQDefense-grade
7Z020Zynq-7000, device 020
CL484484-ball chip-scale BGA

Defense- and space-grade codes often omit the speed grade entirely. Nothing is missing from the part number — the grade is simply not part of how these are ordered.

Product-line prefixes

PrefixQualification
XQRSpace-grade (radiation tolerant)
XQDefense-grade
XAAutomotive (AEC-Q100)
XCStandard commercial/industrial

Device codes by family

The characters immediately after the prefix identify the family. Listed in matching order — the first row that fits wins, which is what keeps KU…P (UltraScale+) apart from KU… (UltraScale).

Device code starts withFamily
VC…, VM…, VE…, VP…, VH…Versal
ZU…DRZynq UltraScale+ RFSoC
ZU…EG, ZU…EV, ZU…CGZynq UltraScale+ MPSoC
KU…PKintex UltraScale+
VU…PVirtex UltraScale+
AU…PArtix UltraScale+
SU…PSpartan UltraScale+
KU… (no trailing P)Kintex UltraScale
VU… (no trailing P)Virtex UltraScale
7A…Artix-7
7K…Kintex-7
7V…Virtex-7
7Z…Zynq-7000
7S…Spartan-7
6S…Spartan-6
6V…Virtex-6
5V…Virtex-5
4V…Virtex-4
2VP…Virtex-II Pro
2V…Virtex-II
3S…Spartan-3
2S…Spartan-II
2C…CoolRunner-II
95…XC9500

Package designators

63 designators. The digits that follow are the ball or pin count, so FFG900 is the FFG package with 900 balls. A trailing G means Pb-free.

PLCC

PCplastic leaded chip carrier

QFP

HQhigh-performance quad flat pack
PQplastic quad flat pack
PQGplastic quad flat pack, Pb-free
TQthin quad flat pack
TQGthin quad flat pack, Pb-free
VQvery thin quad flat pack
VQGvery thin quad flat pack, Pb-free

QFN

VOvery thin quad flat no-lead

BGA

BGball grid array
BGGball grid array, Pb-free
FBfine-pitch ball grid array
FBGfine-pitch ball grid array, Pb-free
FBVAflip-chip ball grid array
FBVBflip-chip ball grid array
FBVCflip-chip ball grid array
FFflip-chip ball grid array
FFGflip-chip ball grid array, Pb-free
FFVAflip-chip ball grid array
FFVBflip-chip ball grid array
FFVCflip-chip ball grid array
FFVDflip-chip ball grid array
FFVEflip-chip ball grid array
FFVFflip-chip ball grid array
FFVGflip-chip ball grid array
FFVHflip-chip ball grid array
FFVIflip-chip ball grid array
FFVJflip-chip ball grid array
FGfine-pitch ball grid array
FGGfine-pitch ball grid array, Pb-free
FGGAfine-pitch ball grid array, Pb-free
FLflip-chip ball grid array
FLGflip-chip ball grid array, Pb-free
FLGAflip-chip ball grid array
FLGBflip-chip ball grid array
FLGCflip-chip ball grid array
FSVAflip-chip ball grid array
FSVBflip-chip ball grid array
FSVCflip-chip ball grid array
FSVDflip-chip ball grid array
FTthin fine-pitch ball grid array
FTGthin fine-pitch ball grid array, Pb-free
FTGBthin fine-pitch ball grid array, Pb-free
RBball grid array
RBGball grid array, Pb-free
SBVAflip-chip ball grid array
SBVBflip-chip ball grid array
SFflip-chip ball grid array
SFGflip-chip ball grid array, Pb-free
SFVAflip-chip ball grid array
SFVBflip-chip ball grid array
SFVCflip-chip ball grid array

CSP

CLchip-scale ball grid array
CLGchip-scale ball grid array, Pb-free
CPchip-scale ball grid array
CPGchip-scale ball grid array, Pb-free
CPGAchip-scale ball grid array, Pb-free
CSchip-scale ball grid array
CSGchip-scale ball grid array, Pb-free
CSGAchip-scale ball grid array, Pb-free
FSBGchip-scale ball grid array
SBchip-scale ball grid array
SBGchip-scale ball grid array, Pb-free

Temperature grades

SuffixGrade
CCommercial
EExtended
IIndustrial
MMilitary
QAutomotive Q-grade

The letter gives the grade, not the range. The actual limits differ by family, and some datasheets quote junction temperature where others quote ambient — so a C on a Spartan-3 and a C on a Zynq UltraScale+ are not the same numbers. Take the range from the device datasheet, never from the suffix.

What the part number does not tell you

  • Available I/O. The number in the package code is the total ball count. Usable user I/O is always lower, differs per device in the same package, and comes from the package file.
  • Lifecycle status. Nothing in an ordering code says whether a part is active, NRND or obsolete. That comes from the manufacturer's product change notices.
  • Whether it was ever built. A code can be perfectly well formed and describe a combination that was never offered. Valid syntax is not evidence of a real part.
  • Die revision or date code. Not encoded. If a build requires a specific revision, it has to be specified separately on the order.

Decode a specific part

Every part page in the catalogue carries this breakdown for that exact code, together with the device specifications and the datasheet it came from. Search a part number, or send us one for price, availability and lead time — including obsolete and end-of-life devices.

Compiled from AMD Xilinx package guides and datasheets. Verify against the manufacturer's current documentation before ordering. Xilinx, Virtex, Kintex, Artix, Spartan, Zynq, UltraScale and Versal are trademarks of Advanced Micro Devices, Inc.