How to read a Xilinx part number
An AMD Xilinx ordering code packs five separate decisions into one string: which product line, which silicon, how fast it is binned, what it is packaged in, and what temperature range it is rated to. Read in the right order it is unambiguous. Read left to right it is not, and a misread costs you a part that does not fit the footprint.
The tables on this page are the same lookup tables FPGA Market uses to decode part numbers across the catalogue, published in full.
Anatomy of an ordering code
XC7Z007S-1LCLG225C — a Zynq-7000 device, speed grade 1L, in a 225-ball Pb-free chip-scale BGA, commercial temperature.
Read it from both ends, not left to right
The suffix has no separators, so the only reliable method is to take the ends first and let the middle fall out:
- 1. Front — the prefix. Two or three letters. XC is the standard line; XA, XQ and XQR mark automotive, defense and space qualification.
- 2. Back — the temperature letter. The single trailing letter after the last run of digits.
- 3. Back again — the ball count. The last run of digits in the string. Two to four digits.
- 4. Front again — the base device. Everything between the prefix and the hyphen.
- 5. What is left is the speed grade and the package letters, run together — and splitting those two is the only genuinely hard step.
The speed grade / package boundary
Take XC6SLX100-1LFGG676C. After the ball count and temperature letter come off, you are holding 1LFGG. There are two readings:
| Reading | Speed | Package | Correct? |
|---|---|---|---|
| 1 + LFGG676 | 1 | LFGG676 | No — LFGG is not a Xilinx package designator |
| 1L + FGG676 | 1L | FGG676 | Yes — fine-pitch BGA, Pb-free, low-voltage speed grade |
Nothing in the string marks the boundary. The rule that resolves it is: the package designator must be one that actually exists. Match the longest real designator that ends the run, and whatever precedes it is the speed grade. A speed grade is one or two digits plus at most one letter — the L for low voltage, occasionally M. If what is left over does not fit that shape, the split is wrong.
This is also why we would rather decode part of a code than all of it. Where a designator is not one we can verify — a newer or rarer package — the base device, ball count and temperature grade are still unambiguous and are shown, and the speed/package split is left alone rather than guessed at.
Worked examples
| XC | Standard product line |
| 4VFX100 | Virtex-4 FX, device 100 |
| 10 | Speed grade 10 |
| FF1152 | 1152-ball flip-chip BGA |
| C | Commercial |
Older families number speed grades 10, 11, 12 rather than 1, 2, 3. A two-digit speed grade is normal on Virtex-4 and earlier — it is not a package code.
| XC | Standard product line |
| 6SLX100 | Spartan-6 LX, device 100 |
| 1L | Speed grade 1, low-voltage |
| FGG676 | 676-ball fine-pitch BGA, Pb-free |
| C | Commercial |
The L belongs to the speed grade, not the package. This is the single most common misreading — see the boundary rule below.
| XC | Standard product line |
| ZU11EG | Zynq UltraScale+ MPSoC, EG device |
| 1 | Speed grade 1 |
| FFVB1517 | 1517-ball flip-chip BGA |
| I | Industrial |
UltraScale+ package designators are four letters, not two. The EG/EV/CG suffix on the device is the processing-system tier, not a package or grade.
| XA | Automotive, AEC-Q100 qualified |
| 7A35T | Artix-7, 35T |
| 1 | Speed grade 1 |
| CPG236 | 236-ball chip-scale BGA, Pb-free |
| Q | Automotive Q-grade |
The qualification is carried twice: XA at the front and Q at the end. An XC part with the same device and package is not an automotive part and is not interchangeable with one.
| XQ | Defense-grade |
| 7Z020 | Zynq-7000, device 020 |
| CL484 | 484-ball chip-scale BGA |
Defense- and space-grade codes often omit the speed grade entirely. Nothing is missing from the part number — the grade is simply not part of how these are ordered.
Product-line prefixes
| Prefix | Qualification |
|---|---|
| XQR | Space-grade (radiation tolerant) |
| XQ | Defense-grade |
| XA | Automotive (AEC-Q100) |
| XC | Standard commercial/industrial |
Device codes by family
The characters immediately after the prefix identify the family. Listed in matching order — the first row that fits wins, which is what keeps KU…P (UltraScale+) apart from KU… (UltraScale).
| Device code starts with | Family |
|---|---|
| VC…, VM…, VE…, VP…, VH… | Versal |
| ZU…DR | Zynq UltraScale+ RFSoC |
| ZU…EG, ZU…EV, ZU…CG | Zynq UltraScale+ MPSoC |
| KU…P | Kintex UltraScale+ |
| VU…P | Virtex UltraScale+ |
| AU…P | Artix UltraScale+ |
| SU…P | Spartan UltraScale+ |
| KU… (no trailing P) | Kintex UltraScale |
| VU… (no trailing P) | Virtex UltraScale |
| 7A… | Artix-7 |
| 7K… | Kintex-7 |
| 7V… | Virtex-7 |
| 7Z… | Zynq-7000 |
| 7S… | Spartan-7 |
| 6S… | Spartan-6 |
| 6V… | Virtex-6 |
| 5V… | Virtex-5 |
| 4V… | Virtex-4 |
| 2VP… | Virtex-II Pro |
| 2V… | Virtex-II |
| 3S… | Spartan-3 |
| 2S… | Spartan-II |
| 2C… | CoolRunner-II |
| 95… | XC9500 |
Package designators
63 designators. The digits that follow are the ball or pin count, so FFG900 is the FFG package with 900 balls. A trailing G means Pb-free.
PLCC
| PC | plastic leaded chip carrier |
QFP
| HQ | high-performance quad flat pack |
| PQ | plastic quad flat pack |
| PQG | plastic quad flat pack, Pb-free |
| TQ | thin quad flat pack |
| TQG | thin quad flat pack, Pb-free |
| VQ | very thin quad flat pack |
| VQG | very thin quad flat pack, Pb-free |
QFN
| VO | very thin quad flat no-lead |
BGA
| BG | ball grid array |
| BGG | ball grid array, Pb-free |
| FB | fine-pitch ball grid array |
| FBG | fine-pitch ball grid array, Pb-free |
| FBVA | flip-chip ball grid array |
| FBVB | flip-chip ball grid array |
| FBVC | flip-chip ball grid array |
| FF | flip-chip ball grid array |
| FFG | flip-chip ball grid array, Pb-free |
| FFVA | flip-chip ball grid array |
| FFVB | flip-chip ball grid array |
| FFVC | flip-chip ball grid array |
| FFVD | flip-chip ball grid array |
| FFVE | flip-chip ball grid array |
| FFVF | flip-chip ball grid array |
| FFVG | flip-chip ball grid array |
| FFVH | flip-chip ball grid array |
| FFVI | flip-chip ball grid array |
| FFVJ | flip-chip ball grid array |
| FG | fine-pitch ball grid array |
| FGG | fine-pitch ball grid array, Pb-free |
| FGGA | fine-pitch ball grid array, Pb-free |
| FL | flip-chip ball grid array |
| FLG | flip-chip ball grid array, Pb-free |
| FLGA | flip-chip ball grid array |
| FLGB | flip-chip ball grid array |
| FLGC | flip-chip ball grid array |
| FSVA | flip-chip ball grid array |
| FSVB | flip-chip ball grid array |
| FSVC | flip-chip ball grid array |
| FSVD | flip-chip ball grid array |
| FT | thin fine-pitch ball grid array |
| FTG | thin fine-pitch ball grid array, Pb-free |
| FTGB | thin fine-pitch ball grid array, Pb-free |
| RB | ball grid array |
| RBG | ball grid array, Pb-free |
| SBVA | flip-chip ball grid array |
| SBVB | flip-chip ball grid array |
| SF | flip-chip ball grid array |
| SFG | flip-chip ball grid array, Pb-free |
| SFVA | flip-chip ball grid array |
| SFVB | flip-chip ball grid array |
| SFVC | flip-chip ball grid array |
CSP
| CL | chip-scale ball grid array |
| CLG | chip-scale ball grid array, Pb-free |
| CP | chip-scale ball grid array |
| CPG | chip-scale ball grid array, Pb-free |
| CPGA | chip-scale ball grid array, Pb-free |
| CS | chip-scale ball grid array |
| CSG | chip-scale ball grid array, Pb-free |
| CSGA | chip-scale ball grid array, Pb-free |
| FSBG | chip-scale ball grid array |
| SB | chip-scale ball grid array |
| SBG | chip-scale ball grid array, Pb-free |
Temperature grades
| Suffix | Grade |
|---|---|
| C | Commercial |
| E | Extended |
| I | Industrial |
| M | Military |
| Q | Automotive Q-grade |
The letter gives the grade, not the range. The actual limits differ by family, and some datasheets quote junction temperature where others quote ambient — so a C on a Spartan-3 and a C on a Zynq UltraScale+ are not the same numbers. Take the range from the device datasheet, never from the suffix.
What the part number does not tell you
- Available I/O. The number in the package code is the total ball count. Usable user I/O is always lower, differs per device in the same package, and comes from the package file.
- Lifecycle status. Nothing in an ordering code says whether a part is active, NRND or obsolete. That comes from the manufacturer's product change notices.
- Whether it was ever built. A code can be perfectly well formed and describe a combination that was never offered. Valid syntax is not evidence of a real part.
- Die revision or date code. Not encoded. If a build requires a specific revision, it has to be specified separately on the order.
Decode a specific part
Every part page in the catalogue carries this breakdown for that exact code, together with the device specifications and the datasheet it came from. Search a part number, or send us one for price, availability and lead time — including obsolete and end-of-life devices.
Compiled from AMD Xilinx package guides and datasheets. Verify against the manufacturer's current documentation before ordering. Xilinx, Virtex, Kintex, Artix, Spartan, Zynq, UltraScale and Versal are trademarks of Advanced Micro Devices, Inc.