XCZU6EG-1FFVB1156E
AMD Xilinx Zynq UltraScale+ MPSoC FPGA
469K system logic cells 1,156-ball BGA Extended
AvailableLifecycle: Active
The XCZU6EG-1FFVB1156E is an AMD Xilinx Zynq UltraScale+ MPSoC FPGA based on the XCZU6EG device, with 469,446 system logic cells, 25,704 Kb of block RAM and 1,973 DSP slices. It comes in the FFVB1156 package (1156-FCBGA, 35 × 35 mm), speed grade -1, extended temperature (0 °C to 100 °C, junction). It runs from a 0.85 V core supply (VCCINT) and has 332 user I/O in this package. It is in active production.
- System Logic Cells
- 469,446
- Block RAM
- 25,704 Kb
- DSP slices
- 1,973
- Balls
- 1,156
- Speed grade
- -1
- Temperature
- Extended
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU6EG-1FFVB1156E
- Base device
- XCZU6EG
- Family
- Zynq UltraScale+ MPSoC
- Package
- FFVB1156
- Package type
- BGA
- Pin / ball count
- 1,156
- Speed grade
- -1
- Temperature grade
- Extended
- Core supply (VCCINT)
- 0.85 V
- Product status
- Active
- ECCN
- 5A002A4 XIL
- HTS code
- 8542.31.0070
- RoHS
- Compliant
Device specifications
- System Logic Cells
- 469,446
- DSP slices
- 1,973
- Block RAM
- 25,704 Kb
- Max transceiver rate
- 16.3 Gb/s
- User I/O (FFVB1156)
- 332
- Processor
- Quad-core Arm Cortex-A53 MPCore™ up to 1.5 GHz
- LUTs
- 214,604
- Flip-flops
- 429,208
- Block RAM blocks (36 Kb)
- 714
- Distributed RAM
- 6.9 Mb
- Clock management tiles
- 4
- GTH transceivers
- 24
Specifications
- Package outline
- 1156-FCBGA, 35 × 35 mm
- Package / case
- 1156-BBGA, FCBGA
- FPGA fabric
- ZynqUltraScale+ FPGA, 469K+ Logic Cells
- Architecture
- MCU, FPGA
- Processor RAM
- 256 KB
- Speed
- 500 MHz, 600 MHz, 1.2 GHz
- Interfaces
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peripherals
- DMA, WDT
- Operating temperature
- 0 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Zynq UltraScale+ MPSOC EG
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU6EG | Base Device | Zynq UltraScale+ MPSoC device XCZU6EG |
| 1 | Speed Grade | Speed grade 1 |
| FFVB1156 | Package | 1156-pin BGA (flip-chip ball grid array) |
| E | Temperature Grade | Extended |
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU6EG-1FFVB1156I | Strong SKU alternate · 96/100Same device, package and speed grade. Industrial (−40 to +100 °C) covers extended (0 to +100 °C) | FFVB1156 | -1 | Industrial |
| XCZU6EG-2FFVB1156I | Likely alternative · 89/100Faster -2 speed grade, same device and package. Industrial (−40 to +100 °C) covers extended (0 to +100 °C) | FFVB1156 | -2 | Industrial |
| XCZU6EG-2FFVB1156E | Likely alternative · 89/100Faster -2 speed grade, same device and package | FFVB1156 | -2 | Extended |
| XCZU6EG-3FFVB1156E | Significant migration work · 45/100Needs 0.9 V VCCINT instead of 0.85 V. Faster -3 speed grade, same device and package | FFVB1156 | -3 | Extended |
| XCZU15EG-1FFVB1156E | Engineering review required · 71/100All 1,156 balls identical in the FFVB1156 package. Different device: the design must be rebuilt | FFVB1156 | -1 | Extended |
| XCZU9EG-1FFVB1156E | Engineering review required · 71/100All 1,156 balls identical in the FFVB1156 package. Different device: the design must be rebuilt | FFVB1156 | -1 | Extended |
| XCZU6CG-1FFVB1156E | Significant migration work · 45/100Different processor: Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz. All 1,156 balls identical in the FFVB1156 package | FFVB1156 | -1 | Extended |
| XCZU9CG-1FFVB1156E | Significant migration work · 45/100Different processor: Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz. All 1,156 balls identical in the FFVB1156 package | FFVB1156 | -1 | Extended |
| XCZU6EG-1FFVC900I | Same device, different package | FFVC900 | -1 | Industrial |
| XCZU6EG-1FFVC900E | Same device, different package | FFVC900 | -1 | Extended |
| XCZU6EG-2FFVC900I | Same device, different package | FFVC900 | -2 | Industrial |
| XCZU6EG-2FFVC900E | Same device, different package | FFVC900 | -2 | Extended |
| XCZU6EG-L1FFVB1156I | Same device, different package | Industrial | ||
| XCZU6EG-L1FFVC900I | Same device, different package | Industrial | ||
| XCZU6EG-L2FFVB1156E | Same device, different package | Extended |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCZU6EG-1FFVB1156E still in production?
- Yes. The XCZU6EG-1FFVB1156E is in active production.
- What package is the XCZU6EG-1FFVB1156E?
- The XCZU6EG-1FFVB1156E comes in the FFVB1156 BGA package (1156-FCBGA, 35 × 35 mm).
- Which versions of the XCZU6EG come in industrial temperature?
- The XCZU6EG-1FFVB1156E is not an industrial-temperature part. 6 XCZU6EG parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU6EG-1FFVB1156IXCZU6EG-2FFVB1156IXCZU6EG-1FFVC900IXCZU6EG-2FFVC900IXCZU6EG-L1FFVB1156IXCZU6EG-L1FFVC900I
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