XCZU9EG-2FFVC900I
AMD Xilinx Zynq UltraScale+ MPSoC FPGA
600K system logic cells 900-ball BGA Industrial
AvailableLifecycle: Active
The XCZU9EG-2FFVC900I is an AMD Xilinx Zynq UltraScale+ MPSoC FPGA based on the XCZU9EG device, with 599,550 system logic cells, 32,832 Kb of block RAM and 2,520 DSP slices. It comes in the FFVC900 package (900-FCBGA, 31 × 31 mm), speed grade -2, industrial temperature (-40 °C to 100 °C, junction). It runs from a 0.85 V core supply (VCCINT) and has 207 user I/O in this package. It is in active production.
- System Logic Cells
- 599,550
- Block RAM
- 32,832 Kb
- DSP slices
- 2,520
- Balls
- 900
- Speed grade
- -2
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU9EG-2FFVC900I
- Base device
- XCZU9EG
- Family
- Zynq UltraScale+ MPSoC
- Package
- FFVC900
- Package type
- BGA
- Pin / ball count
- 900
- Speed grade
- -2
- Temperature grade
- Industrial
- Core supply (VCCINT)
- 0.85 V
- Product status
- Active
- ECCN
- 5A992C
- HTS code
- 8542.31.0070
- RoHS
- Compliant
Device specifications
- System Logic Cells
- 599,550
- DSP slices
- 2,520
- Block RAM
- 32,832 Kb
- Max transceiver rate
- 16.3 Gb/s
- User I/O (FFVC900)
- 207
- Processor
- Quad-core Arm Cortex-A53 MPCore™ up to 1.5 GHz
- LUTs
- 274,080
- Flip-flops
- 548,160
- Block RAM blocks (36 Kb)
- 912
- Distributed RAM
- 8.8 Mb
- Clock management tiles
- 4
- GTH transceivers
- 24
Specifications
- Package outline
- 900-FCBGA, 31 × 31 mm
- Package / case
- 900-BBGA, FCBGA
- FPGA fabric
- ZynqUltraScale+ FPGA, 599K+ Logic Cells
- Architecture
- MCU, FPGA
- Processor RAM
- 256 KB
- Speed
- 533 MHz, 600 MHz, 1.3 GHz
- Interfaces
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peripherals
- DMA, WDT
- Operating temperature
- -40 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Zynq UltraScale+ MPSOC EG
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU9EG | Base Device | Zynq UltraScale+ MPSoC device XCZU9EG |
| 2 | Speed Grade | Speed grade 2 |
| FFVC900 | Package | 900-pin BGA (flip-chip ball grid array) |
| I | Temperature Grade | Industrial |
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU9EG-2FFVC900E | Engineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed grade | FFVC900 | -2 | Extended |
| XCZU9EG-3FFVC900E | Significant migration work · 45/100Needs 0.9 V VCCINT instead of 0.85 V. Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C) | FFVC900 | -3 | Extended |
| XCZU15EG-2FFVC900I | Engineering review required · 71/100All 900 balls identical in the FFVC900 package. Different device: the design must be rebuilt | FFVC900 | -2 | Industrial |
| XCZU6EG-2FFVC900I | Engineering review required · 55/100Smaller device (469,446 vs 599,550 logic cells). All 900 balls identical in the FFVC900 package | FFVC900 | -2 | Industrial |
| XCZU6CG-2FFVC900I | Significant migration work · 45/100Different processor: Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz. Smaller device (469,446 vs 599,550 logic cells) | FFVC900 | -2 | Industrial |
| XCZU9CG-2FFVC900I | Significant migration work · 45/100Different processor: Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz. All 900 balls identical in the FFVC900 package | FFVC900 | -2 | Industrial |
| XCZU9EG-1FFVC900I | Engineering review required · 69/100Slower -1 speed grade: timing must be re-closed | FFVC900 | -1 | Industrial |
| XCZU9EG-1FFVC900E | Engineering review required · 69/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Slower -1 speed grade: timing must be re-closed | FFVC900 | -1 | Extended |
| XCZU9EG-1FFVB1156I | Same device, different package | FFVB1156 | -1 | Industrial |
| XCZU9EG-1FFVB1156E | Same device, different package | FFVB1156 | -1 | Extended |
| XCZU9EG-2FFVB1156I | Same device, different package | FFVB1156 | -2 | Industrial |
| XCZU9EG-2FFVB1156E | Same device, different package | FFVB1156 | -2 | Extended |
| XCZU9EG-3FFVB1156E | Same device, different package | FFVB1156 | -3 | Extended |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCZU9EG-2FFVC900I still in production?
- Yes. The XCZU9EG-2FFVC900I is in active production.
- What package is the XCZU9EG-2FFVC900I?
- The XCZU9EG-2FFVC900I comes in the FFVC900 BGA package (900-FCBGA, 31 × 31 mm).
- Which versions of the XCZU9EG come in industrial temperature?
- The XCZU9EG-2FFVC900I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 3 other XCZU9EG parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU9EG-1FFVC900IXCZU9EG-1FFVB1156IXCZU9EG-2FFVB1156I
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