FPGA Market

XCZU4EV-3FBVB900E

AMD XilinxZynq UltraScale+ MPSoCFPGA

Part details

Manufacturer
AMD Xilinx
Part number
XCZU4EV-3FBVB900E
Base device
XCZU4EV
Family
Zynq UltraScale+ MPSoC
Package
FBVB900
Package type
BGA
Speed grade
3
Temperature grade
Extended

Device specifications

System Logic Cells
192,000
DSP slices
728
Block RAM
21,094 Kb
User I/O (FBVB900)
207
Processor
Quad-core Arm Cortex-A53 MPCore up to 1.5 GHz

Part number breakdown

SegmentFieldMeaning
Base DeviceZynq UltraScale+ MPSoC device XCZU4EV
Speed GradeSpeed grade 3
Package900-pin BGA (flip-chip ball grid array)
Temperature GradeExtended

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XCZU4EV-1FBVB900CSame device, different speed and temperature gradeFBVB900-1Commercial
XCZU4EV-1FBVB900ISame device, different speed and temperature gradeFBVB900-1Industrial
XCZU4EV-1FBVB900ESame device, different speed gradeFBVB900-1Extended
XCZU4EV-2FBVB900CSame device, different speed and temperature gradeFBVB900-2Commercial
XCZU4EV-2FBVB900ISame device, different speed and temperature gradeFBVB900-2Industrial
XCZU4EV-2FBVB900ESame device, different speed gradeFBVB900-2Extended
XCZU4EV-3FBVB900CSame device, different speed and temperature gradeFBVB900-3Commercial
XCZU4EV-1SFVC784CSame device, different packageSFVC784-1Commercial
XCZU4EV-1SFVC784ISame device, different packageSFVC784-1Industrial
XCZU4EV-1SFVC784ESame device, different packageSFVC784-1Extended
XCZU4EV-2SFVC784CSame device, different packageSFVC784-2Commercial
XCZU4EV-2SFVC784ISame device, different packageSFVC784-2Industrial
XCZU4EV-2SFVC784ESame device, different packageSFVC784-2Extended
XCZU4EV-3SFVC784CSame device, different packageSFVC784-3Commercial
XCZU4EV-L1SFVC784ISame device, different packageIndustrial
XCZU4EV-L2SFVC784ESame device, different packageExtended
XCZU4EV-L2FBVB900ESame device, different packageExtended

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