XCZU4EV-1SFVC784E
AMD Xilinx Zynq UltraScale+ MPSoC FPGA
192K system logic cells 784-ball BGA Extended
AvailableLifecycle: Active
The XCZU4EV-1SFVC784E is an AMD Xilinx Zynq UltraScale+ MPSoC FPGA based on the XCZU4EV device, with 192,150 system logic cells, 4,608 Kb of block RAM and 728 DSP slices. It comes in the SFVC784 package (784-FCBGA, 23 × 23 mm), speed grade -1, extended temperature (0 °C to 100 °C, junction). It runs from a 0.85 V core supply (VCCINT) and has 255 user I/O in this package. It is in active production.
- System Logic Cells
- 192,150
- Block RAM
- 4,608 Kb
- DSP slices
- 728
- Balls
- 784
- Speed grade
- -1
- Temperature
- Extended
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU4EV-1SFVC784E
- Base device
- XCZU4EV
- Family
- Zynq UltraScale+ MPSoC
- Package
- SFVC784
- Package type
- BGA
- Pin / ball count
- 784
- Speed grade
- -1
- Temperature grade
- Extended
- Core supply (VCCINT)
- 0.85 V
- Product status
- Active
- ECCN
- 5A992C
- HTS code
- 8542.31.0070
- RoHS
- Compliant
Device specifications
- System Logic Cells
- 192,150
- DSP slices
- 728
- Block RAM
- 4,608 Kb
- User I/O (SFVC784)
- 255
- Processor
- Quad-core Arm Cortex-A53 MPCore up to 1.5 GHz
- LUTs
- 87,840
- Flip-flops
- 175,680
- Block RAM blocks (36 Kb)
- 128
- Distributed RAM
- 2.6 Mb
- UltraRAM
- 13.5 Mb
- Clock management tiles
- 4
Specifications
- Package outline
- 784-FCBGA, 23 × 23 mm
- Package / case
- 784-BFBGA, FCBGA
- FPGA fabric
- ZynqUltraScale+ FPGA, 192K+ Logic Cells
- Architecture
- MCU, FPGA
- Processor RAM
- 256 KB
- Speed
- 500 MHz, 600 MHz, 1.2 GHz
- Interfaces
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peripherals
- DMA, WDT
- Operating temperature
- 0 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Zynq UltraScale+ MPSOC EV
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU4EV | Base Device | Zynq UltraScale+ MPSoC device XCZU4EV |
| 1 | Speed Grade | Speed grade 1 |
| SFVC784 | Package | 784-pin BGA (flip-chip ball grid array) |
| E | Temperature Grade | Extended |
Documentation
- XCZU4EV-1FBVB900I datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU4EV-1SFVC784I | Strong SKU alternate · 96/100Same device, package and speed grade. Industrial (−40 to +100 °C) covers extended (0 to +100 °C) | SFVC784 | -1 | Industrial |
| XCZU4EV-2SFVC784I | Likely alternative · 89/100Faster -2 speed grade, same device and package. Industrial (−40 to +100 °C) covers extended (0 to +100 °C) | SFVC784 | -2 | Industrial |
| XCZU4EV-2SFVC784E | Likely alternative · 89/100Faster -2 speed grade, same device and package | SFVC784 | -2 | Extended |
| XCZU5EV-1SFVC784E | Engineering review required · 71/100All 784 balls identical in the SFVC784 package. Different device: the design must be rebuilt | SFVC784 | -1 | Extended |
| XCZU4EV-1FBVB900I | Same device, different package | FBVB900 | -1 | Industrial |
| XCZU4EV-1FBVB900E | Same device, different package | FBVB900 | -1 | Extended |
| XCZU4EV-2FBVB900I | Same device, different package | FBVB900 | -2 | Industrial |
| XCZU4EV-2FBVB900E | Same device, different package | FBVB900 | -2 | Extended |
| XCZU4EV-3FBVB900E | Same device, different package | FBVB900 | -3 | Extended |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCZU4EV-1SFVC784E still in production?
- Yes. The XCZU4EV-1SFVC784E is in active production.
- What package is the XCZU4EV-1SFVC784E?
- The XCZU4EV-1SFVC784E comes in the SFVC784 BGA package (784-FCBGA, 23 × 23 mm).
- Which versions of the XCZU4EV come in industrial temperature?
- The XCZU4EV-1SFVC784E is not an industrial-temperature part. 4 XCZU4EV parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU4EV-1SFVC784IXCZU4EV-2SFVC784IXCZU4EV-1FBVB900IXCZU4EV-2FBVB900I
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