FPGA Market

XCZU4EV-1FBVB900I

AMD Xilinx Zynq UltraScale+ MPSoC FPGA

192K system logic cells 900-ball BGA Industrial

Available

The XCZU4EV-1FBVB900I is an AMD Xilinx Zynq UltraScale+ MPSoC FPGA based on the XCZU4EV device, with 192,150 system logic cells, 4,608 Kb of block RAM and 728 DSP slices. It comes in the FBVB900 package (900-FCBGA, 31 × 31 mm), speed grade -1, industrial temperature (-40 °C to 100 °C, junction). It runs from a 0.85 V core supply (VCCINT) and has 207 user I/O in this package.

System Logic Cells
192,150
Block RAM
4,608 Kb
DSP slices
728
Balls
900
Speed grade
-1
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XCZU4EV-1FBVB900I
Base device
XCZU4EV
Family
Zynq UltraScale+ MPSoC
Package
FBVB900
Package type
BGA
Pin / ball count
900
Speed grade
-1
Temperature grade
Industrial
Core supply (VCCINT)
0.85 V

Device specifications

System Logic Cells
192,150
DSP slices
728
Block RAM
4,608 Kb
User I/O (FBVB900)
207
Processor
Quad-core Arm Cortex-A53 MPCore up to 1.5 GHz
LUTs
87,840
Flip-flops
175,680
Block RAM blocks (36 Kb)
128
Distributed RAM
2.6 Mb
UltraRAM
13.5 Mb
Clock management tiles
4

Specifications

Package outline
900-FCBGA, 31 × 31 mm
Package / case
900-BBGA, FCBGA
FPGA fabric
ZynqUltraScale+ FPGA, 192K+ Logic Cells
Architecture
MCU, FPGA
Processor RAM
256 KB
Speed
500 MHz, 600 MHz, 1.2 GHz
Interfaces
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals
DMA, WDT
Operating temperature
-40 °C to 100 °C (junction)

Part number breakdown

SegmentFieldMeaning
XCZU4EVBase DeviceZynq UltraScale+ MPSoC device XCZU4EV
1Speed GradeSpeed grade 1
FBVB900Package900-pin BGA (flip-chip ball grid array)
ITemperature GradeIndustrial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XCZU4EV-1FBVB900EEngineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed gradeFBVB900-1Extended
XCZU4EV-2FBVB900ILikely alternative · 89/100Faster -2 speed grade, same device and packageFBVB900-2Industrial
XCZU4EV-2FBVB900EEngineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Faster -2 speed grade, same device and packageFBVB900-2Extended
XCZU4EV-3FBVB900ESignificant migration work · 45/100Needs 0.9 V VCCINT instead of 0.85 V. Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C)FBVB900-3Extended
XCZU5EV-1FBVB900IEngineering review required · 71/100All 900 balls identical in the FBVB900 package. Different device: the design must be rebuiltFBVB900-1Industrial
XCZU7EV-1FBVB900IEngineering review required · 59/100Same FBVB900 balls, but 48 I/O sit in renumbered banks: constraints change. Different device: the design must be rebuiltFBVB900-1Industrial
XCZU4EV-1SFVC784ISame device, different packageSFVC784-1Industrial
XCZU4EV-1SFVC784ESame device, different packageSFVC784-1Extended
XCZU4EV-2SFVC784ISame device, different packageSFVC784-2Industrial
XCZU4EV-2SFVC784ESame device, different packageSFVC784-2Extended

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

What package is the XCZU4EV-1FBVB900I?
The XCZU4EV-1FBVB900I comes in the FBVB900 BGA package (900-FCBGA, 31 × 31 mm).
Which versions of the XCZU4EV come in industrial temperature?
The XCZU4EV-1FBVB900I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 3 other XCZU4EV parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU4EV-2FBVB900IXCZU4EV-1SFVC784IXCZU4EV-2SFVC784I

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