XC7Z100-2FFG900I
AMD Xilinx Zynq-7000 soc fpga
444K logic cells 900-ball BGA Industrial
AvailableLifecycle: Active
The XC7Z100-2FFG900I is an AMD Xilinx Zynq-7000 soc fpga based on the XC7Z100 device, with 444,000 logic cells, 27,136 Kb of block RAM and 2,020 DSP slices. It comes in the FFG900 package (900-FCBGA, 31 × 31 mm), speed grade -2, industrial temperature (-40 °C to 100 °C, junction). It runs from a 1.0 V core supply (VCCINT) and has 362 user I/O in this package. It is in active production.
- Logic Cells
- 444,000
- Block RAM
- 27,136 Kb
- DSP slices
- 2,020
- Balls
- 900
- Speed grade
- -2
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XC7Z100-2FFG900I
- Base device
- XC7Z100
- Family
- Zynq-7000
- Package
- FFG900
- Package type
- BGA
- Pin / ball count
- 900
- Speed grade
- -2
- Temperature grade
- Industrial
- Core supply (VCCINT)
- 1.0 V
- Product status
- Active
- ECCN
- 3A991D
- HTS code
- 8542.31.0070
- RoHS
- Compliant
Device specifications
- Logic Cells
- 444,000
- DSP slices
- 2,020
- Block RAM
- 27,136 Kb
- Transceivers
- 16
- User I/O (FFG900)
- 362
Specifications
- Package outline
- 900-FCBGA, 31 × 31 mm
- Package / case
- 900-BBGA, FCBGA
- FPGA fabric
- Kintex-7 FPGA, 444K Logic Cells
- Architecture
- MCU, FPGA
- Processor RAM
- 256 KB
- Speed
- 800 MHz
- Processor core
- Dual ARM Cortex-A9 MPCore with CoreSight
- Interfaces
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peripherals
- DMA
- Operating temperature
- -40 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Zynq-7000
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XC7Z100 | Base Device | Zynq-7000 device XC7Z100 |
| 2 | Speed Grade | Speed grade 2 |
| FFG900 | Package | 900-pin BGA (flip-chip ball grid array, Pb-free) |
| I | Temperature Grade | Industrial |
Documentation
- XC7Z100-1FFG1156I datasheetAMD Xilinx document
- XC7Z100-2FF900I datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XC7Z100-2FF900I | Likely alternative · 83/100Leaded FF900 version of the lead-free FFG900 package | FF900 | -2 | Industrial |
| XC7Z035-2FFG900I | Engineering review required · 55/100Smaller device (275,000 vs 444,000 logic cells). All 900 balls identical in the FFG900 package | FFG900 | -2 | Industrial |
| XC7Z045-2FFG900I | Engineering review required · 55/100Smaller device (350,000 vs 444,000 logic cells). All 900 balls identical in the FFG900 package | FFG900 | -2 | Industrial |
| XC7Z100-1FFG900I | Engineering review required · 69/100Slower -1 speed grade: timing must be re-closed | FFG900 | -1 | Industrial |
| XC7Z100-1FF900I | Same device, different package | FF900 | -1 | Industrial |
| XC7Z100-1FFG1156I | Same device, different package | FFG1156 | -1 | Industrial |
| XC7Z100-2FFG1156I | Same device, different package | FFG1156 | -2 | Industrial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XC7Z100-2FFG900I still in production?
- Yes. The XC7Z100-2FFG900I is in active production.
- What package is the XC7Z100-2FFG900I?
- The XC7Z100-2FFG900I comes in the FFG900 BGA package (900-FCBGA, 31 × 31 mm).
- Which versions of the XC7Z100 come in industrial temperature?
- The XC7Z100-2FFG900I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 5 other XC7Z100 parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC7Z100-1FFG900IXC7Z100-1FF900IXC7Z100-2FF900IXC7Z100-1FFG1156IXC7Z100-2FFG1156I
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