FPGA Market

XC7Z100-2FFG1156I

AMD XilinxZynq-7000SoC FPGA

Part details

Manufacturer
AMD Xilinx
Part number
XC7Z100-2FFG1156I
Base device
XC7Z100
Family
Zynq-7000
Package
FFG1156
Package type
BGA
Pin / ball count
1,156
Speed grade
-2
Temperature grade
Industrial

Device specifications

Logic Cells
444,000
DSP slices
2,020
Block RAM
27,136 Kb
Transceivers
16
User I/O (FFG1156)
400

Part number breakdown

SegmentFieldMeaning
XC7Z100Base DeviceZynq-7000 device XC7Z100
2Speed GradeSpeed grade 2
FFG1156Package1156-pin BGA (flip-chip ball grid array, Pb-free)
ITemperature GradeIndustrial

Related part numbers

Part numberRelationshipPackageSpeedTemperature
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XC7Z100-2LFFG1156CSame device, different speed and temperature gradeFFG1156-2LCommercial
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XC7Z100-1LFFG900CSame device, different packageFFG900-1LCommercial
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XC7Z100-2FFG900CSame device, different packageFFG900-2Commercial
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XC7Z100-2LFFG900CSame device, different packageFFG900-2LCommercial
XC7Z100-2LFFG900ISame device, different packageFFG900-2LIndustrial
XC7Z100-3FFG900CSame device, different packageFFG900-3Commercial
XC7Z100-L2FFG900ISame device, different packageIndustrial
XC7Z100-L2FFG1156ISame device, different packageIndustrial

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