XC7Z100-1FFG1156I
AMD Xilinx Zynq-7000 soc fpga
444K logic cells 1,156-ball BGA Industrial
Available
The XC7Z100-1FFG1156I is an AMD Xilinx Zynq-7000 soc fpga based on the XC7Z100 device, with 444,000 logic cells, 27,136 Kb of block RAM and 2,020 DSP slices. It comes in the FFG1156 package (1156-FCBGA, 35 × 35 mm), speed grade -1, industrial temperature (-40 °C to 100 °C, junction). It runs from a 1.0 V core supply (VCCINT) and has 400 user I/O in this package.
- Logic Cells
- 444,000
- Block RAM
- 27,136 Kb
- DSP slices
- 2,020
- Balls
- 1,156
- Speed grade
- -1
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XC7Z100-1FFG1156I
- Base device
- XC7Z100
- Family
- Zynq-7000
- Package
- FFG1156
- Package type
- BGA
- Pin / ball count
- 1,156
- Speed grade
- -1
- Temperature grade
- Industrial
- Core supply (VCCINT)
- 1.0 V
Device specifications
- Logic Cells
- 444,000
- DSP slices
- 2,020
- Block RAM
- 27,136 Kb
- Transceivers
- 16
- User I/O (FFG1156)
- 400
Specifications
- Package outline
- 1156-FCBGA, 35 × 35 mm
- Package / case
- 1156-BBGA, FCBGA
- FPGA fabric
- Kintex-7 FPGA, 444K Logic Cells
- Architecture
- MCU, FPGA
- Processor RAM
- 256 KB
- Speed
- 667 MHz
- Processor core
- Dual ARM Cortex-A9 MPCore with CoreSight
- Interfaces
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peripherals
- DMA
- Operating temperature
- -40 °C to 100 °C (junction)
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XC7Z100 | Base Device | Zynq-7000 device XC7Z100 |
| 1 | Speed Grade | Speed grade 1 |
| FFG1156 | Package | 1156-pin BGA (flip-chip ball grid array, Pb-free) |
| I | Temperature Grade | Industrial |
Documentation
- XC7Z100-1FFG1156I datasheetAMD Xilinx document
- XC7Z100-2FF900I datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XC7Z100-2FFG1156I | Likely alternative · 89/100Faster -2 speed grade, same device and package | FFG1156 | -2 | Industrial |
| XC7Z100-1FF900I | Same device, different package | FF900 | -1 | Industrial |
| XC7Z100-2FF900I | Same device, different package | FF900 | -2 | Industrial |
| XC7Z100-1FFG900I | Same device, different package | FFG900 | -1 | Industrial |
| XC7Z100-2FFG900I | Same device, different package | FFG900 | -2 | Industrial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- What package is the XC7Z100-1FFG1156I?
- The XC7Z100-1FFG1156I comes in the FFG1156 BGA package (1156-FCBGA, 35 × 35 mm).
- Which versions of the XC7Z100 come in industrial temperature?
- The XC7Z100-1FFG1156I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 5 other XC7Z100 parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC7Z100-2FFG1156IXC7Z100-1FF900IXC7Z100-2FF900IXC7Z100-1FFG900IXC7Z100-2FFG900I
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