XCZU7EG-1FBVB900I
AMD Xilinx Zynq UltraScale+ MPSoC FPGA
504K system logic cells 900-ball BGA Industrial
Available
The XCZU7EG-1FBVB900I is an AMD Xilinx Zynq UltraScale+ MPSoC FPGA based on the XCZU7EG device, with 504,000 system logic cells, 11,232 Kb of block RAM and 1,728 DSP slices. It comes in the FBVB900 package (900-FCBGA, 31 × 31 mm), speed grade -1, industrial temperature (-40 °C to 100 °C, junction). It runs from a 0.85 V core supply (VCCINT) and has 207 user I/O in this package.
- System Logic Cells
- 504,000
- Block RAM
- 11,232 Kb
- DSP slices
- 1,728
- Balls
- 900
- Speed grade
- -1
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU7EG-1FBVB900I
- Base device
- XCZU7EG
- Family
- Zynq UltraScale+ MPSoC
- Package
- FBVB900
- Package type
- BGA
- Pin / ball count
- 900
- Speed grade
- -1
- Temperature grade
- Industrial
- Core supply (VCCINT)
- 0.85 V
Device specifications
- System Logic Cells
- 504,000
- DSP slices
- 1,728
- Block RAM
- 11,232 Kb
- Max transceiver rate
- 16.3 Gb/s
- User I/O (FBVB900)
- 207
- Processor
- Quad-core Arm Cortex-A53 MPCore™ up to 1.5 GHz
- LUTs
- 230,400
- Flip-flops
- 460,800
- Block RAM blocks (36 Kb)
- 312
- Distributed RAM
- 6.2 Mb
- UltraRAM
- 27 Mb
- Clock management tiles
- 8
- GTH transceivers
- 24
Specifications
- Package outline
- 900-FCBGA, 31 × 31 mm
- Package / case
- 900-BBGA, FCBGA
- FPGA fabric
- ZynqUltraScale+ FPGA, 504K+ Logic Cells
- Architecture
- MCU, FPGA
- Processor RAM
- 256 KB
- Speed
- 500 MHz, 600 MHz, 1.2 GHz
- Interfaces
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peripherals
- DMA, WDT
- Operating temperature
- -40 °C to 100 °C (junction)
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU7EG | Base Device | Zynq UltraScale+ MPSoC device XCZU7EG |
| 1 | Speed Grade | Speed grade 1 |
| FBVB900 | Package | 900-pin BGA (flip-chip ball grid array) |
| I | Temperature Grade | Industrial |
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU7EG-1FBVB900E | Engineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed grade | FBVB900 | -1 | Extended |
| XCZU7EG-2FBVB900I | Likely alternative · 89/100Faster -2 speed grade, same device and package | FBVB900 | -2 | Industrial |
| XCZU7EG-2FBVB900E | Engineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Faster -2 speed grade, same device and package | FBVB900 | -2 | Extended |
| XCZU4EG-1FBVB900I | Engineering review required · 55/100Smaller device (192,150 vs 504,000 logic cells). Same FBVB900 balls, but 48 I/O sit in renumbered banks: constraints change | FBVB900 | -1 | Industrial |
| XCZU5EG-1FBVB900I | Engineering review required · 55/100Smaller device (256,200 vs 504,000 logic cells). Same FBVB900 balls, but 48 I/O sit in renumbered banks: constraints change | FBVB900 | -1 | Industrial |
| XCZU4CG-1FBVB900I | Significant migration work · 45/100Different processor: Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz. Smaller device (192,150 vs 504,000 logic cells) | FBVB900 | -1 | Industrial |
| XCZU5CG-1FBVB900I | Significant migration work · 45/100Different processor: Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz. Smaller device (256,200 vs 504,000 logic cells) | FBVB900 | -1 | Industrial |
| XCZU7CG-1FBVB900I | Significant migration work · 45/100Different processor: Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz. All 900 balls identical in the FBVB900 package | FBVB900 | -1 | Industrial |
| XCZU7EG-1FFVC1156I | Same device, different package | FFVC1156 | -1 | Industrial |
| XCZU7EG-1FFVC1156E | Same device, different package | FFVC1156 | -1 | Extended |
| XCZU7EG-2FFVC1156I | Same device, different package | FFVC1156 | -2 | Industrial |
| XCZU7EG-2FFVC1156E | Same device, different package | FFVC1156 | -2 | Extended |
| XCZU7EG-3FFVC1156E | Same device, different package | FFVC1156 | -3 | Extended |
| XCZU7EG-1FFVF1517I | Same device, different package | FFVF1517 | -1 | Industrial |
| XCZU7EG-1FFVF1517E | Same device, different package | FFVF1517 | -1 | Extended |
| XCZU7EG-2FFVF1517I | Same device, different package | FFVF1517 | -2 | Industrial |
| XCZU7EG-2FFVF1517E | Same device, different package | FFVF1517 | -2 | Extended |
| XCZU7EG-3FFVF1517E | Same device, different package | FFVF1517 | -3 | Extended |
| XCZU7EG-L1FFVC1156I | Same device, different package | Industrial | ||
| XCZU7EG-L1FBVB900I | Same device, different package | Industrial | ||
| XCZU7EG-L2FBVB900E | Same device, different package | Extended |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- What package is the XCZU7EG-1FBVB900I?
- The XCZU7EG-1FBVB900I comes in the FBVB900 BGA package (900-FCBGA, 31 × 31 mm).
- Which versions of the XCZU7EG come in industrial temperature?
- The XCZU7EG-1FBVB900I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 7 other XCZU7EG parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU7EG-2FBVB900IXCZU7EG-1FFVC1156IXCZU7EG-2FFVC1156IXCZU7EG-1FFVF1517IXCZU7EG-2FFVF1517IXCZU7EG-L1FFVC1156IXCZU7EG-L1FBVB900I
Guides and comparisons
Need XCZU7EG-1FBVB900I?
Send the quantity and we'll check current market availability, pricing and lead time.
Check Stock & Pricing