FPGA Market

XCZU4CG-1FBVB900I

AMD XilinxZynq UltraScale+ MPSoCFPGA

Part details

Manufacturer
AMD Xilinx
Part number
XCZU4CG-1FBVB900I
Base device
XCZU4CG
Family
Zynq UltraScale+ MPSoC
Package
FBVB900
Package type
BGA
Pin / ball count
900
Speed grade
-1
Temperature grade
Industrial

Device specifications

System Logic Cells
192,000
DSP slices
728
Block RAM
21,094 Kb
Transceivers
16
Max transceiver rate
16.3 Gb/s
User I/O (FBVB900)
207
Processor
Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz

Part number breakdown

SegmentFieldMeaning
XCZU4CGBase DeviceZynq UltraScale+ MPSoC device XCZU4CG
1Speed GradeSpeed grade 1
FBVB900Package900-pin BGA (flip-chip ball grid array)
ITemperature GradeIndustrial

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XCZU4CG-1FBVB900CSame device, commercial temperatureFBVB900-1Commercial
XCZU4CG-1FBVB900ESame device, extended temperatureFBVB900-1Extended
XCZU4CG-2FBVB900CSame device, different speed and temperature gradeFBVB900-2Commercial
XCZU4CG-2FBVB900ISame device, different speed gradeFBVB900-2Industrial
XCZU4CG-2FBVB900ESame device, different speed and temperature gradeFBVB900-2Extended
XCZU4CG-3FBVB900CSame device, different speed and temperature gradeFBVB900-3Commercial
XCZU4CG-1SFVC784CSame device, different packageSFVC784-1Commercial
XCZU4CG-1SFVC784ISame device, different packageSFVC784-1Industrial
XCZU4CG-1SFVC784ESame device, different packageSFVC784-1Extended
XCZU4CG-2SFVC784CSame device, different packageSFVC784-2Commercial
XCZU4CG-2SFVC784ISame device, different packageSFVC784-2Industrial
XCZU4CG-2SFVC784ESame device, different packageSFVC784-2Extended
XCZU4CG-3SFVC784CSame device, different packageSFVC784-3Commercial

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