XCZU46DR-2FFVH1760I
AMD XilinxZynq UltraScale+ RFSoCRFSoC
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU46DR-2FFVH1760I
- Base device
- XCZU46DR
- Family
- Zynq UltraScale+ RFSoC
- Package
- FFVH1760
- Package type
- BGA
- Pin / ball count
- 1,760
- Speed grade
- -2
- Temperature grade
- Industrial
Device specifications
- User I/O (FFVH1760)
- 366
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU46DR | Base Device | Zynq UltraScale+ RFSoC device XCZU46DR |
| 2 | Speed Grade | Speed grade 2 |
| FFVH1760 | Package | 1760-pin BGA (flip-chip ball grid array) |
| I | Temperature Grade | Industrial |
Related part numbers
| Part number | Relationship | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU46DR-1FFVH1760C | Same device, different speed and temperature grade | FFVH1760 | -1 | Commercial |
| XCZU46DR-1FFVH1760I | Same device, different speed grade | FFVH1760 | -1 | Industrial |
| XCZU46DR-1FFVH1760E | Same device, different speed and temperature grade | FFVH1760 | -1 | Extended |
| XCZU46DR-2FFVH1760C | Same device, commercial temperature | FFVH1760 | -2 | Commercial |
| XCZU46DR-2FFVH1760E | Same device, extended temperature | FFVH1760 | -2 | Extended |
| XCZU46DR-3FFVH1760C | Same device, different speed and temperature grade | FFVH1760 | -3 | Commercial |
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