FPGA Market

XCZU46DR-2FFVH1760E

AMD XilinxZynq UltraScale+ RFSoCRFSoC

Part details

Manufacturer
AMD Xilinx
Part number
XCZU46DR-2FFVH1760E
Base device
XCZU46DR
Family
Zynq UltraScale+ RFSoC
Package
FFVH1760
Package type
BGA
Pin / ball count
1,760
Speed grade
-2
Temperature grade
Extended

Device specifications

User I/O (FFVH1760)
366

Part number breakdown

SegmentFieldMeaning
XCZU46DRBase DeviceZynq UltraScale+ RFSoC device XCZU46DR
2Speed GradeSpeed grade 2
FFVH1760Package1760-pin BGA (flip-chip ball grid array)
ETemperature GradeExtended

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XCZU46DR-1FFVH1760CSame device, different speed and temperature gradeFFVH1760-1Commercial
XCZU46DR-1FFVH1760ISame device, different speed and temperature gradeFFVH1760-1Industrial
XCZU46DR-1FFVH1760ESame device, different speed gradeFFVH1760-1Extended
XCZU46DR-2FFVH1760CSame device, commercial temperatureFFVH1760-2Commercial
XCZU46DR-2FFVH1760ISame device, industrial temperatureFFVH1760-2Industrial
XCZU46DR-3FFVH1760CSame device, different speed and temperature gradeFFVH1760-3Commercial

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