XCZU46DR-2FFVH1760E
AMD Xilinx Zynq UltraScale+ RFSoC
930K logic cells 1,760-ball BGA Extended
AvailableLifecycle: Active
The XCZU46DR-2FFVH1760E is an AMD Xilinx Zynq UltraScale+ RFSoC based on the XCZU46DR device, with 930,300 logic cells, 38,880 Kb of block RAM and 4,272 DSP slices. It comes in the FFVH1760 package (1760-FCBGA, 42.5 × 42.5 mm), speed grade -2, extended temperature (0 °C to 100 °C, junction). It has 366 user I/O in this package. It is in active production.
- Logic cells
- 930,300
- Block RAM
- 38,880 Kb
- DSP slices
- 4,272
- Balls
- 1,760
- Speed grade
- -2
- Temperature
- Extended
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU46DR-2FFVH1760E
- Base device
- XCZU46DR
- Family
- Zynq UltraScale+ RFSoC
- Package
- FFVH1760
- Package type
- BGA
- Pin / ball count
- 1,760
- Speed grade
- -2
- Temperature grade
- Extended
- Product status
- Active
- HTS code
- 8542.31.0070
- RoHS
- Compliant
Device specifications
- Logic cells
- 930,300
- DSP slices
- 4,272
- Block RAM
- 38,880 Kb
- User I/O (FFVH1760)
- 366
- LUTs
- 425,280
- Flip-flops
- 850,560
- Block RAM blocks (36 Kb)
- 1,080
- Distributed RAM
- 13 Mb
- UltraRAM
- 22.5 Mb
- Clock management tiles
- 8
- GTY transceivers
- 16
Specifications
- Package outline
- 1760-FCBGA, 42.5 × 42.5 mm
- Package / case
- 1760-BBGA, FCBGA
- FPGA fabric
- ZynqUltraScale+ FPGA, 930K+ Logic Cells
- Architecture
- MCU, FPGA
- Processor RAM
- 256 KB
- Speed
- 533 MHz, 1.333 GHz
- Processor core
- Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight
- Interfaces
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peripherals
- DDR, DMA, PCIe
- Operating temperature
- 0 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Zynq UltraScale+ RFSoC
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU46DR | Base Device | Zynq UltraScale+ RFSoC device XCZU46DR |
| 2 | Speed Grade | Speed grade 2 |
| FFVH1760 | Package | 1760-pin BGA (flip-chip ball grid array) |
| E | Temperature Grade | Extended |
Documentation
- XCZU46DR-1FFVH1760I datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU46DR-1FFVH1760I | Same device, different speed and temperature grade | FFVH1760 | -1 | Industrial |
| XCZU46DR-1FFVH1760E | Same device, different speed grade | FFVH1760 | -1 | Extended |
| XCZU46DR-2FFVH1760I | Same device, industrial temperature | FFVH1760 | -2 | Industrial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCZU46DR-2FFVH1760E still in production?
- Yes. The XCZU46DR-2FFVH1760E is in active production.
- What package is the XCZU46DR-2FFVH1760E?
- The XCZU46DR-2FFVH1760E comes in the FFVH1760 BGA package (1760-FCBGA, 42.5 × 42.5 mm).
- Which versions of the XCZU46DR come in industrial temperature?
- The XCZU46DR-2FFVH1760E is not an industrial-temperature part. 2 XCZU46DR parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU46DR-1FFVH1760IXCZU46DR-2FFVH1760I
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