FPGA Market

XCZU46DR-1FFVH1760I

AMD Xilinx Zynq UltraScale+ RFSoC

930K logic cells 1,760-ball BGA Industrial

Available

The XCZU46DR-1FFVH1760I is an AMD Xilinx Zynq UltraScale+ RFSoC based on the XCZU46DR device, with 930,300 logic cells, 38,880 Kb of block RAM and 4,272 DSP slices. It comes in the FFVH1760 package (1760-FCBGA, 42.5 × 42.5 mm), speed grade -1, industrial temperature (-40 °C to 100 °C, junction). It has 366 user I/O in this package.

Logic cells
930,300
Block RAM
38,880 Kb
DSP slices
4,272
Balls
1,760
Speed grade
-1
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XCZU46DR-1FFVH1760I
Base device
XCZU46DR
Family
Zynq UltraScale+ RFSoC
Package
FFVH1760
Package type
BGA
Pin / ball count
1,760
Speed grade
-1
Temperature grade
Industrial

Device specifications

Logic cells
930,300
DSP slices
4,272
Block RAM
38,880 Kb
User I/O (FFVH1760)
366
LUTs
425,280
Flip-flops
850,560
Block RAM blocks (36 Kb)
1,080
Distributed RAM
13 Mb
UltraRAM
22.5 Mb
Clock management tiles
8
GTY transceivers
16

Specifications

Package outline
1760-FCBGA, 42.5 × 42.5 mm
Package / case
1760-BBGA, FCBGA
FPGA fabric
ZynqUltraScale+ FPGA, 930K+ Logic Cells
Architecture
MCU, FPGA
Processor RAM
256 KB
Speed
500 MHz, 1.2 GHz
Processor core
Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight
Interfaces
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals
DDR, DMA, PCIe
Operating temperature
-40 °C to 100 °C (junction)

Part number breakdown

SegmentFieldMeaning
XCZU46DRBase DeviceZynq UltraScale+ RFSoC device XCZU46DR
1Speed GradeSpeed grade 1
FFVH1760Package1760-pin BGA (flip-chip ball grid array)
ITemperature GradeIndustrial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XCZU46DR-1FFVH1760ESame device, extended temperatureFFVH1760-1Extended
XCZU46DR-2FFVH1760ISame device, different speed gradeFFVH1760-2Industrial
XCZU46DR-2FFVH1760ESame device, different speed and temperature gradeFFVH1760-2Extended

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

What package is the XCZU46DR-1FFVH1760I?
The XCZU46DR-1FFVH1760I comes in the FFVH1760 BGA package (1760-FCBGA, 42.5 × 42.5 mm).
Which versions of the XCZU46DR come in industrial temperature?
The XCZU46DR-1FFVH1760I is itself an industrial-temperature part (-40 °C to 100 °C, junction). One other XCZU46DR part is industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU46DR-2FFVH1760I

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