FPGA Market

XCZU25DR-2FFVE1156I

AMD Xilinx Zynq UltraScale+ RFSoC

678K logic cells 1,156-ball BGA Industrial

Available

The XCZU25DR-2FFVE1156I is an AMD Xilinx Zynq UltraScale+ RFSoC based on the XCZU25DR device, with 678,318 logic cells, 28,512 Kb of block RAM and 3,145 DSP slices. It comes in the FFVE1156 package (1,156 balls), speed grade -2, industrial temperature. It has 154 user I/O in this package.

Logic cells
678,318
Block RAM
28,512 Kb
DSP slices
3,145
Balls
1,156
Speed grade
-2
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XCZU25DR-2FFVE1156I
Base device
XCZU25DR
Family
Zynq UltraScale+ RFSoC
Package
FFVE1156
Package type
BGA
Pin / ball count
1,156
Speed grade
-2
Temperature grade
Industrial

Device specifications

Logic cells
678,318
DSP slices
3,145
Block RAM
28,512 Kb
User I/O (FFVE1156)
154
LUTs
310,088
Flip-flops
620,176
Block RAM blocks (36 Kb)
792
Distributed RAM
9.6 Mb
UltraRAM
13.5 Mb
Clock management tiles
6
GTY transceivers
8

Part number breakdown

SegmentFieldMeaning
XCZU25DRBase DeviceZynq UltraScale+ RFSoC device XCZU25DR
2Speed GradeSpeed grade 2
FFVE1156Package1156-pin BGA (flip-chip ball grid array)
ITemperature GradeIndustrial

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XCZU25DR-1FFVE1156CSame device, different speed and temperature gradeFFVE1156-1Commercial
XCZU25DR-1FFVE1156ISame device, different speed gradeFFVE1156-1Industrial
XCZU25DR-1FFVE1156ESame device, different speed and temperature gradeFFVE1156-1Extended
XCZU25DR-2FFVE1156CSame device, commercial temperatureFFVE1156-2Commercial
XCZU25DR-2FFVE1156ESame device, extended temperatureFFVE1156-2Extended
XCZU25DR-3FFVE1156CSame device, different speed and temperature gradeFFVE1156-3Commercial
XCZU25DR-1FFVG1517CSame device, different packageFFVG1517-1Commercial
XCZU25DR-1FFVG1517ISame device, different packageFFVG1517-1Industrial
XCZU25DR-1FFVG1517ESame device, different packageFFVG1517-1Extended
XCZU25DR-2FFVG1517CSame device, different packageFFVG1517-2Commercial
XCZU25DR-2FFVG1517ISame device, different packageFFVG1517-2Industrial
XCZU25DR-2FFVG1517ESame device, different packageFFVG1517-2Extended
XCZU25DR-3FFVG1517CSame device, different packageFFVG1517-3Commercial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

What package is the XCZU25DR-2FFVE1156I?
The XCZU25DR-2FFVE1156I comes in the FFVE1156 BGA package (1,156 pins).
Which versions of the XCZU25DR come in industrial temperature?
The XCZU25DR-2FFVE1156I is itself an industrial-temperature part. 3 other XCZU25DR parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU25DR-1FFVE1156IXCZU25DR-1FFVG1517IXCZU25DR-2FFVG1517I

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