AMD Xilinx · Zynq UltraScale+ RFSoC RFSoC
XCZU25DR
XCZU25DR is a base device. Each orderable part adds a package, speed grade and temperature grade: 4 parts are listed below. Send the exact part number and quantity and we'll come back with price, availability and lead time.
- Logic cells
- 678,318
- DSP slices
- 3,145
- Block RAM
- 28,512 Kb
- Packages
- 4
- Parts
- 4
Specifications
- Manufacturer
- AMD Xilinx
- Family
- Zynq UltraScale+ RFSoC
- Product type
- RFSoC
- Logic cells
- 678,318
- DSP slices
- 3,145
- Block RAM
- 28,512 Kb
XCZU25DR orderable part numbers
| Part number | Package | Pins | Speed | Temperature | Status | |
|---|---|---|---|---|---|---|
| XCZU25DR-3FFVE1156C | FFVE1156 | 1,156 | -3 | Commercial | Check availability | |
| XCZU25DR-1FFVG1517C | FFVG1517 | 1,517 | -1 | Commercial | Check availability | |
| XCZU25DR-1FFVG1517I | FFVG1517 | 1,517 | -1 | Industrial | Check availability | |
| XCZU25DR-2FFVG1517E | FFVG1517 | 1,517 | -2 | Extended | Check availability |
Package options
User I/O is given per package rather than as a device maximum, because it differs between packages.
| Package | Type | Balls / Pins | User I/O |
|---|---|---|---|
| FFVE1156 | BGA | 1,156 | 154 |
| FSVE1156 | BGA | 1,156 | |
| FFVG1517 | BGA | 1,517 | 353 |
| FSVG1517 | BGA | 1,517 |