XCZU25DR-1FFVE1156C
AMD Xilinx Zynq UltraScale+ RFSoC
678K logic cells 1,156-ball BGA Commercial
Available
The XCZU25DR-1FFVE1156C is an AMD Xilinx Zynq UltraScale+ RFSoC based on the XCZU25DR device, with 678,318 logic cells, 28,512 Kb of block RAM and 3,145 DSP slices. It comes in the FFVE1156 package (1,156 balls), speed grade -1, commercial temperature. It has 154 user I/O in this package.
- Logic cells
- 678,318
- Block RAM
- 28,512 Kb
- DSP slices
- 3,145
- Balls
- 1,156
- Speed grade
- -1
- Temperature
- Commercial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU25DR-1FFVE1156C
- Base device
- XCZU25DR
- Family
- Zynq UltraScale+ RFSoC
- Package
- FFVE1156
- Package type
- BGA
- Pin / ball count
- 1,156
- Speed grade
- -1
- Temperature grade
- Commercial
Device specifications
- Logic cells
- 678,318
- DSP slices
- 3,145
- Block RAM
- 28,512 Kb
- User I/O (FFVE1156)
- 154
- LUTs
- 310,088
- Flip-flops
- 620,176
- Block RAM blocks (36 Kb)
- 792
- Distributed RAM
- 9.6 Mb
- UltraRAM
- 13.5 Mb
- Clock management tiles
- 6
- GTY transceivers
- 8
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU25DR | Base Device | Zynq UltraScale+ RFSoC device XCZU25DR |
| 1 | Speed Grade | Speed grade 1 |
| FFVE1156 | Package | 1156-pin BGA (flip-chip ball grid array) |
| C | Temperature Grade | Commercial |
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU25DR-1FFVE1156I | Same device, industrial temperature | FFVE1156 | -1 | Industrial |
| XCZU25DR-1FFVE1156E | Same device, extended temperature | FFVE1156 | -1 | Extended |
| XCZU25DR-2FFVE1156C | Same device, different speed grade | FFVE1156 | -2 | Commercial |
| XCZU25DR-2FFVE1156I | Same device, different speed and temperature grade | FFVE1156 | -2 | Industrial |
| XCZU25DR-2FFVE1156E | Same device, different speed and temperature grade | FFVE1156 | -2 | Extended |
| XCZU25DR-3FFVE1156C | Same device, different speed grade | FFVE1156 | -3 | Commercial |
| XCZU25DR-1FFVG1517C | Same device, different package | FFVG1517 | -1 | Commercial |
| XCZU25DR-1FFVG1517I | Same device, different package | FFVG1517 | -1 | Industrial |
| XCZU25DR-1FFVG1517E | Same device, different package | FFVG1517 | -1 | Extended |
| XCZU25DR-2FFVG1517C | Same device, different package | FFVG1517 | -2 | Commercial |
| XCZU25DR-2FFVG1517I | Same device, different package | FFVG1517 | -2 | Industrial |
| XCZU25DR-2FFVG1517E | Same device, different package | FFVG1517 | -2 | Extended |
| XCZU25DR-3FFVG1517C | Same device, different package | FFVG1517 | -3 | Commercial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- What package is the XCZU25DR-1FFVE1156C?
- The XCZU25DR-1FFVE1156C comes in the FFVE1156 BGA package (1,156 pins).
- Which versions of the XCZU25DR come in industrial temperature?
- The XCZU25DR-1FFVE1156C is not an industrial-temperature part. 4 XCZU25DR parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU25DR-1FFVE1156IXCZU25DR-2FFVE1156IXCZU25DR-1FFVG1517IXCZU25DR-2FFVG1517I
Guides and comparisons
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