FPGA Market

XCZU15EG-1FFVB1156I

AMD Xilinx Zynq UltraScale+ MPSoC FPGA

747K system logic cells 1,156-ball BGA Industrial

Available

The XCZU15EG-1FFVB1156I is an AMD Xilinx Zynq UltraScale+ MPSoC FPGA based on the XCZU15EG device, with 746,550 system logic cells, 26,784 Kb of block RAM and 3,528 DSP slices. It comes in the FFVB1156 package (1156-FCBGA, 35 × 35 mm), speed grade -1, industrial temperature (-40 °C to 100 °C, junction). It runs from a 0.85 V core supply (VCCINT) and has 332 user I/O in this package.

System Logic Cells
746,550
Block RAM
26,784 Kb
DSP slices
3,528
Balls
1,156
Speed grade
-1
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XCZU15EG-1FFVB1156I
Base device
XCZU15EG
Family
Zynq UltraScale+ MPSoC
Package
FFVB1156
Package type
BGA
Pin / ball count
1,156
Speed grade
-1
Temperature grade
Industrial
Core supply (VCCINT)
0.85 V

Device specifications

System Logic Cells
746,550
DSP slices
3,528
Block RAM
26,784 Kb
Max transceiver rate
16.3 Gb/s
User I/O (FFVB1156)
332
Processor
Quad-core Arm Cortex-A53 MPCore™ up to 1.5 GHz
LUTs
341,280
Flip-flops
682,560
Block RAM blocks (36 Kb)
744
Distributed RAM
11.3 Mb
UltraRAM
31.5 Mb
Clock management tiles
4
GTH transceivers
24

Specifications

Package outline
1156-FCBGA, 35 × 35 mm
Package / case
1156-BBGA, FCBGA
FPGA fabric
ZynqUltraScale+ FPGA, 747K+ Logic Cells
Architecture
MCU, FPGA
Processor RAM
256 KB
Speed
500 MHz, 600 MHz, 1.2 GHz
Interfaces
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals
DMA, WDT
Operating temperature
-40 °C to 100 °C (junction)

Part number breakdown

SegmentFieldMeaning
XCZU15EGBase DeviceZynq UltraScale+ MPSoC device XCZU15EG
1Speed GradeSpeed grade 1
FFVB1156Package1156-pin BGA (flip-chip ball grid array)
ITemperature GradeIndustrial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XCZU15EG-1FFVB1156EEngineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed gradeFFVB1156-1Extended
XCZU15EG-2FFVB1156ILikely alternative · 89/100Faster -2 speed grade, same device and packageFFVB1156-2Industrial
XCZU15EG-2FFVB1156EEngineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Faster -2 speed grade, same device and packageFFVB1156-2Extended
XCZU6EG-1FFVB1156IEngineering review required · 55/100Smaller device (469,446 vs 746,550 logic cells). All 1,156 balls identical in the FFVB1156 packageFFVB1156-1Industrial
XCZU9EG-1FFVB1156IEngineering review required · 55/100Smaller device (599,550 vs 746,550 logic cells). All 1,156 balls identical in the FFVB1156 packageFFVB1156-1Industrial
XCZU6CG-1FFVB1156ISignificant migration work · 45/100Different processor: Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz. Smaller device (469,446 vs 746,550 logic cells)FFVB1156-1Industrial
XCZU9CG-1FFVB1156ISignificant migration work · 45/100Different processor: Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz. Smaller device (599,550 vs 746,550 logic cells)FFVB1156-1Industrial
XCZU15EG-1FFVC900ISame device, different packageFFVC900-1Industrial
XCZU15EG-1FFVC900ESame device, different packageFFVC900-1Extended
XCZU15EG-2FFVC900ISame device, different packageFFVC900-2Industrial
XCZU15EG-2FFVC900ESame device, different packageFFVC900-2Extended

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

What package is the XCZU15EG-1FFVB1156I?
The XCZU15EG-1FFVB1156I comes in the FFVB1156 BGA package (1156-FCBGA, 35 × 35 mm).
Which versions of the XCZU15EG come in industrial temperature?
The XCZU15EG-1FFVB1156I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 3 other XCZU15EG parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU15EG-2FFVB1156IXCZU15EG-1FFVC900IXCZU15EG-2FFVC900I

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