FPGA Market

XCZU15EG-2FFVB1156E

AMD XilinxZynq UltraScale+ MPSoCFPGA

Part details

Manufacturer
AMD Xilinx
Part number
XCZU15EG-2FFVB1156E
Base device
XCZU15EG
Family
Zynq UltraScale+ MPSoC
Package
FFVB1156
Package type
BGA
Pin / ball count
1,156
Speed grade
-2
Temperature grade
Extended

Device specifications

System Logic Cells
747,000
DSP slices
3,528
Block RAM
70,656 Kb
Transceivers
24
Max transceiver rate
16.3 Gb/s
User I/O (FFVB1156)
332
Processor
Quad-core Arm Cortex-A53 MPCore™ up to 1.5 GHz

Part number breakdown

SegmentFieldMeaning
XCZU15EGBase DeviceZynq UltraScale+ MPSoC device XCZU15EG
2Speed GradeSpeed grade 2
FFVB1156Package1156-pin BGA (flip-chip ball grid array)
ETemperature GradeExtended

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XCZU15EG-1FFVB1156CSame device, different speed and temperature gradeFFVB1156-1Commercial
XCZU15EG-1FFVB1156ISame device, different speed and temperature gradeFFVB1156-1Industrial
XCZU15EG-1FFVB1156ESame device, different speed gradeFFVB1156-1Extended
XCZU15EG-2FFVB1156CSame device, commercial temperatureFFVB1156-2Commercial
XCZU15EG-2FFVB1156ISame device, industrial temperatureFFVB1156-2Industrial
XCZU15EG-3FFVB1156CSame device, different speed and temperature gradeFFVB1156-3Commercial
XCZU15EG-1FFVC900CSame device, different packageFFVC900-1Commercial
XCZU15EG-1FFVC900ISame device, different packageFFVC900-1Industrial
XCZU15EG-1FFVC900ESame device, different packageFFVC900-1Extended
XCZU15EG-2FFVC900CSame device, different packageFFVC900-2Commercial
XCZU15EG-2FFVC900ISame device, different packageFFVC900-2Industrial
XCZU15EG-2FFVC900ESame device, different packageFFVC900-2Extended
XCZU15EG-3FFVC900CSame device, different packageFFVC900-3Commercial
XCZU15EG-L1FFVC900ISame device, different packageIndustrial
XCZU15EG-L2FFVC900ESame device, different packageExtended

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