XCZU11EG-1FFVC1760I
AMD Xilinx Zynq UltraScale+ MPSoC FPGA
653K system logic cells 1,760-ball BGA Industrial
AvailableLifecycle: Active
The XCZU11EG-1FFVC1760I is an AMD Xilinx Zynq UltraScale+ MPSoC FPGA based on the XCZU11EG device, with 653,100 system logic cells, 21,600 Kb of block RAM and 2,928 DSP slices. It comes in the FFVC1760 package (1760-FCBGA, 42.5 × 42.5 mm), speed grade -1, industrial temperature (-40 °C to 100 °C, junction). It runs from a 0.85 V core supply (VCCINT) and has 520 user I/O in this package. It is in active production.
- System Logic Cells
- 653,100
- Block RAM
- 21,600 Kb
- DSP slices
- 2,928
- Balls
- 1,760
- Speed grade
- -1
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU11EG-1FFVC1760I
- Base device
- XCZU11EG
- Family
- Zynq UltraScale+ MPSoC
- Package
- FFVC1760
- Package type
- BGA
- Pin / ball count
- 1,760
- Speed grade
- -1
- Temperature grade
- Industrial
- Core supply (VCCINT)
- 0.85 V
- Product status
- Active
- ECCN
- 5A002A4 XIL
- HTS code
- 8542.31.0070
- RoHS
- Compliant
Device specifications
- System Logic Cells
- 653,100
- DSP slices
- 2,928
- Block RAM
- 21,600 Kb
- Max transceiver rate
- 32.75 Gb/s
- User I/O (FFVC1760)
- 520
- Processor
- Quad-core Arm Cortex-A53 MPCore™ up to 1.5 GHz
- LUTs
- 298,560
- Flip-flops
- 597,120
- Block RAM blocks (36 Kb)
- 600
- Distributed RAM
- 9.1 Mb
- UltraRAM
- 22.5 Mb
- Clock management tiles
- 8
- GTH transceivers
- 32
- GTY transceivers
- 16
Specifications
- Package outline
- 1760-FCBGA, 42.5 × 42.5 mm
- Package / case
- 1760-BBGA, FCBGA
- FPGA fabric
- ZynqUltraScale+ FPGA, 653K+ Logic Cells
- Architecture
- MCU, FPGA
- Processor RAM
- 256 KB
- Speed
- 500 MHz, 600 MHz, 1.2 GHz
- Interfaces
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peripherals
- DMA, WDT
- Operating temperature
- -40 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Zynq UltraScale+ MPSOC EG
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU11EG | Base Device | Zynq UltraScale+ MPSoC device XCZU11EG |
| 1 | Speed Grade | Speed grade 1 |
| FFVC1760 | Package | 1760-pin BGA (flip-chip ball grid array) |
| I | Temperature Grade | Industrial |
Documentation
- XCZU11EG-1FFVB1517I datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU11EG-1FFVC1760E | Engineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed grade | FFVC1760 | -1 | Extended |
| XCZU11EG-2FFVC1760I | Likely alternative · 89/100Faster -2 speed grade, same device and package | FFVC1760 | -2 | Industrial |
| XCZU11EG-2FFVC1760E | Engineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Faster -2 speed grade, same device and package | FFVC1760 | -2 | Extended |
| XCZU11EG-3FFVC1760E | Significant migration work · 45/100Needs 0.9 V VCCINT instead of 0.85 V. Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C) | FFVC1760 | -3 | Extended |
| XCZU17EG-1FFVC1760I | Engineering review required · 59/100Same FFVC1760 balls, but 96 I/O sit in renumbered banks: constraints change. Different device: the design must be rebuilt | FFVC1760 | -1 | Industrial |
| XCZU19EG-1FFVC1760I | Engineering review required · 59/100Same FFVC1760 balls, but 96 I/O sit in renumbered banks: constraints change. Different device: the design must be rebuilt | FFVC1760 | -1 | Industrial |
| XCZU11EG-1FFVB1517I | Same device, different package | FFVB1517 | -1 | Industrial |
| XCZU11EG-1FFVB1517E | Same device, different package | FFVB1517 | -1 | Extended |
| XCZU11EG-2FFVB1517I | Same device, different package | FFVB1517 | -2 | Industrial |
| XCZU11EG-2FFVB1517E | Same device, different package | FFVB1517 | -2 | Extended |
| XCZU11EG-1FFVC1156I | Same device, different package | FFVC1156 | -1 | Industrial |
| XCZU11EG-1FFVC1156E | Same device, different package | FFVC1156 | -1 | Extended |
| XCZU11EG-2FFVC1156I | Same device, different package | FFVC1156 | -2 | Industrial |
| XCZU11EG-2FFVC1156E | Same device, different package | FFVC1156 | -2 | Extended |
| XCZU11EG-3FFVC1156E | Same device, different package | FFVC1156 | -3 | Extended |
| XCZU11EG-1FFVF1517I | Same device, different package | FFVF1517 | -1 | Industrial |
| XCZU11EG-1FFVF1517E | Same device, different package | FFVF1517 | -1 | Extended |
| XCZU11EG-2FFVF1517I | Same device, different package | FFVF1517 | -2 | Industrial |
| XCZU11EG-2FFVF1517E | Same device, different package | FFVF1517 | -2 | Extended |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCZU11EG-1FFVC1760I still in production?
- Yes. The XCZU11EG-1FFVC1760I is in active production.
- What package is the XCZU11EG-1FFVC1760I?
- The XCZU11EG-1FFVC1760I comes in the FFVC1760 BGA package (1760-FCBGA, 42.5 × 42.5 mm).
- Which versions of the XCZU11EG come in industrial temperature?
- The XCZU11EG-1FFVC1760I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 7 other XCZU11EG parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU11EG-2FFVC1760IXCZU11EG-1FFVB1517IXCZU11EG-2FFVB1517IXCZU11EG-1FFVC1156IXCZU11EG-2FFVC1156IXCZU11EG-1FFVF1517IXCZU11EG-2FFVF1517I
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