FPGA Market

XC3S700A-5FTG256C

AMD Xilinx Spartan-3 FPGA

13K logic cells 256-ball Commercial

AvailableLifecycle: ObsoleteNotice: XCN23009

The XC3S700A-5FTG256C is an AMD Xilinx Spartan-3 FPGA based on the XC3S700A device, with 13,248 logic cells and 360 Kb of block RAM. It comes in the FTG256 package (256-FTBGA, 17 × 17 mm), speed grade 5, commercial temperature (0 °C to 85 °C, junction). It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.

Logic cells
13,248
Block RAM
360 Kb
Pins
256
Speed grade
5
Temperature
Commercial

Part details

Manufacturer
AMD Xilinx
Part number
XC3S700A-5FTG256C
Base device
XC3S700A
Family
Spartan-3
Package
FTG256
Pin / ball count
256
Speed grade
5
Temperature grade
Commercial
Product status
Obsolete
Manufacturer notice
XCN23009
ECCN
3A001A7B
HTS code
8542.31.0060
RoHS
Compliant

Device specifications

Logic cells
13,248
Block RAM
360 Kb

Specifications

Package outline
256-FTBGA, 17 × 17 mm
Package / case
256-LBGA
Mounting
Surface Mount
User I/O
161
LABs / CLBs
1,472
System gates
700,000
Supply voltage
1.14 V to 1.26 V
Operating temperature
0 °C to 85 °C (junction)
Moisture sensitivity (MSL)
Level 3 (168 hours)
Series
Spartan-3A
Last time buy
29 Jun 2024

Part number breakdown

SegmentFieldMeaning
XC3S700ABase DeviceSpartan-3 device XC3S700A
5Speed GradeSpeed grade 5
FTG256Package256-pin BGA (thin fine-pitch ball grid array, Pb-free)
CTemperature GradeCommercial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XC3S700A-4FG400CSame device, different packageFG400-4Commercial
XC3S700A-4FG400ISame device, different packageFG400-4Industrial
XC3S700A-5FG400CSame device, different packageFG400-5Commercial
XC3S700A-4FG484CSame device, different packageFG484-4Commercial
XC3S700A-4FG484ISame device, different packageFG484-4Industrial
XC3S700A-5FG484CSame device, different packageFG484-5Commercial
XC3S700A-4FGG400CSame device, different packageFGG400-4Commercial
XC3S700A-4FGG400ISame device, different packageFGG400-4Industrial
XC3S700A-5FGG400CSame device, different packageFGG400-5Commercial
XC3S700A-4FGG484CSame device, different packageFGG484-4Commercial
XC3S700A-4FGG484ISame device, different packageFGG484-4Industrial
XC3S700A-5FGG484CSame device, different packageFGG484-5Commercial
XC3S700A-4FT256CSame device, different packageFT256-4Commercial
XC3S700A-4FT256ISame device, different packageFT256-4Industrial
XC3S700A-5FT256CSame device, different packageFT256-5Commercial
XC3S700A-4FTG256CSame device, different speed gradeFTG256-4Commercial
XC3S700A-4FTG256ISame device, different speed and temperature gradeFTG256-4Industrial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XC3S700A-5FTG256C still in production?
No. The XC3S700A-5FTG256C has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
Is there a direct replacement for the XC3S700A-5FTG256C?
No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3S700A-5FTG256C. Either the remaining supply is used, or the board is revised around a current device.
What package is the XC3S700A-5FTG256C?
The XC3S700A-5FTG256C comes in the FTG256 package (256-FTBGA, 17 × 17 mm).
Which versions of the XC3S700A come in industrial temperature?
The XC3S700A-5FTG256C is not an industrial-temperature part. 6 XC3S700A parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S700A-4FTG256IXC3S700A-4FG400IXC3S700A-4FG484IXC3S700A-4FGG400IXC3S700A-4FGG484IXC3S700A-4FT256I

XC3S700A discontinued?

We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.

XC3S700A replacement options

Guides and comparisons

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