FPGA Market

XC3S700A-4FG400I

AMD Xilinx Spartan-3 FPGA

13K logic cells 400-ball Industrial

AvailableLifecycle: ObsoleteNotice: XCN23009

The XC3S700A-4FG400I is an AMD Xilinx Spartan-3 FPGA based on the XC3S700A device, with 13,248 logic cells and 360 Kb of block RAM. It comes in the FG400 package (400-FBGA, 21 × 21 mm), speed grade 4, industrial temperature (-40 °C to 100 °C, junction). It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.

Logic cells
13,248
Block RAM
360 Kb
Pins
400
Speed grade
4
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XC3S700A-4FG400I
Base device
XC3S700A
Family
Spartan-3
Package
FG400
Pin / ball count
400
Speed grade
4
Temperature grade
Industrial
Product status
Obsolete
Manufacturer notice
XCN23009
ECCN
3A991D
HTS code
8542.31.0060
RoHS
Not compliant

Device specifications

Logic cells
13,248
Block RAM
360 Kb

Specifications

Package outline
400-FBGA, 21 × 21 mm
Package / case
400-BGA
Mounting
Surface Mount
User I/O
311
LABs / CLBs
1,472
System gates
700,000
Supply voltage
1.14 V to 1.26 V
Operating temperature
-40 °C to 100 °C (junction)
Moisture sensitivity (MSL)
Level 3 (168 hours)
Series
Spartan-3A
Last time buy
29 Jun 2024

Part number breakdown

SegmentFieldMeaning
XC3S700ABase DeviceSpartan-3 device XC3S700A
4Speed GradeSpeed grade 4
FG400Package400-pin BGA (fine-pitch ball grid array)
ITemperature GradeIndustrial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XC3S700A-4FG400CSame device, commercial temperatureFG400-4Commercial
XC3S700A-5FG400CSame device, different speed and temperature gradeFG400-5Commercial
XC3S700A-4FG484CSame device, different packageFG484-4Commercial
XC3S700A-4FG484ISame device, different packageFG484-4Industrial
XC3S700A-5FG484CSame device, different packageFG484-5Commercial
XC3S700A-4FGG400CSame device, different packageFGG400-4Commercial
XC3S700A-4FGG400ISame device, different packageFGG400-4Industrial
XC3S700A-5FGG400CSame device, different packageFGG400-5Commercial
XC3S700A-4FGG484CSame device, different packageFGG484-4Commercial
XC3S700A-4FGG484ISame device, different packageFGG484-4Industrial
XC3S700A-5FGG484CSame device, different packageFGG484-5Commercial
XC3S700A-4FT256CSame device, different packageFT256-4Commercial
XC3S700A-4FT256ISame device, different packageFT256-4Industrial
XC3S700A-5FT256CSame device, different packageFT256-5Commercial
XC3S700A-4FTG256CSame device, different packageFTG256-4Commercial
XC3S700A-4FTG256ISame device, different packageFTG256-4Industrial
XC3S700A-5FTG256CSame device, different packageFTG256-5Commercial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XC3S700A-4FG400I still in production?
No. The XC3S700A-4FG400I has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
Is there a direct replacement for the XC3S700A-4FG400I?
No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3S700A-4FG400I. Either the remaining supply is used, or the board is revised around a current device.
What package is the XC3S700A-4FG400I?
The XC3S700A-4FG400I comes in the FG400 package (400-FBGA, 21 × 21 mm).
Which versions of the XC3S700A come in industrial temperature?
The XC3S700A-4FG400I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 5 other XC3S700A parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S700A-4FG484IXC3S700A-4FGG400IXC3S700A-4FGG484IXC3S700A-4FT256IXC3S700A-4FTG256I

XC3S700A discontinued?

We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.

XC3S700A replacement options

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