FPGA Market

Obsolete device

XC3S700A replacement options

The AMD Xilinx XC3S700A has been discontinued by the manufacturer. There are two ways forward, and for most people reading this the first one is the answer: keep the design and source the part. Changing device means a board revision, so it is only worth it if you are redesigning anyway.

What the manufacturer says

AMD Xilinx's discontinuation notice lists no direct replacement for all 18 XC3S700A parts it covers. Where the manufacturer offers nothing equivalent, the remaining supply is the only way to keep the board unchanged.

From the manufacturer's discontinuation notice: Product Discontinuation Notice for XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II,

1. Keep the design — source the XC3S700A

Discontinued parts are still traded. We hold 18 orderable XC3S700A parts — send the exact code and quantity and we'll come back with stock and pricing, including date-code and traceability requirements.

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Part numberPackagePinsSpeedTemperature
XC3S700A-4FG400CFG4004004Commercial
XC3S700A-4FG400IFG4004004Industrial
XC3S700A-5FG400CFG4005Commercial
XC3S700A-4FG484CFG4844844Commercial
XC3S700A-4FG484IFG4844844Industrial
XC3S700A-5FG484CFG4845Commercial
XC3S700A-4FGG400CFGG4004004Commercial
XC3S700A-4FGG400IFGG4004004Industrial
XC3S700A-5FGG400CFGG4004005Commercial
XC3S700A-4FGG484CFGG4844844Commercial
XC3S700A-4FGG484IFGG4844844Industrial
XC3S700A-5FGG484CFGG4844845Commercial
XC3S700A-4FT256CFT2564Commercial
XC3S700A-4FT256IFT2562564Industrial
XC3S700A-5FT256CFT2565Commercial
XC3S700A-4FTG256CFTG2562564Commercial

All 18 XC3S700A parts

A different package or speed grade of the same device is the closest thing to a like-for-like change: the silicon is the same, so only the footprint or timing differs. It still needs checking against your board.

2. Redesigning? Current devices of similar capacity

AMD Xilinx devices still in production with comparable logic capacity, closest first. These are a shortlist to evaluate, not equivalents: none of them is pin-compatible with the XC3S700A, and none is recommended by the manufacturer as its successor. We select them by capacity from the data on this site.

DeviceFamilyLogic cellsvs XC3S700ABlock RAMDSPParts
XC3S700ASpartan-313,248The original360 Kb18
XC7A15TArtix-716,6401.3× the logic cells900 Kb4525
XA7A15TArtix-716,6401.3× the logic cells900 Kb6
XCSU25PSpartan UltraScale+21,8751.7× the logic cells1,728 Kb364
XC7S25Spartan-723,3601.8× the logic cells1,620 Kb8015
XC7A25TArtix-723,3601.8× the logic cells1,620 Kb809
XA7A25TArtix-723,3601.8× the logic cells1,620 Kb6

What to check before changing device

  • Footprint and pinout

    Ball count, pitch and pin assignment all differ between families. A new device means a new layout.

  • I/O voltages and banks

    Supported I/O standards, bank voltages and the number of banks change between generations.

  • Core and I/O supplies

    Newer devices usually run a lower core voltage and need a different power tree.

  • Configuration

    Flash type, configuration mode and boot timing are family-specific.

  • Tools and IP

    The design has to be rebuilt in the current toolchain, and IP cores may need replacing or re-licensing.

  • Temperature and lifetime

    Check the grade you need exists, and how long the new family is expected to stay in production.

Where a design cannot be revised — certified equipment, long-life industrial and defence builds — sourcing the original is normally the cheaper route, even at obsolete pricing.

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