XC3S2000-4FGG900C
AMD Xilinx Spartan-3 FPGA
46K logic cells 900-ball Commercial
AvailableNotice: XCN23009
The XC3S2000-4FGG900C is an AMD Xilinx Spartan-3 FPGA based on the XC3S2000 device, with 46,080 logic cells and 720 Kb of block RAM. It comes in the FGG900 package (900-FBGA, 31 × 31 mm), speed grade 4, commercial temperature (0 °C to 85 °C, junction). It runs from a 1.2 V core supply (VCCINT).
- Logic cells
- 46,080
- Block RAM
- 720 Kb
- Pins
- 900
- Speed grade
- 4
- Temperature
- Commercial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XC3S2000-4FGG900C
- Base device
- XC3S2000
- Family
- Spartan-3
- Package
- FGG900
- Pin / ball count
- 900
- Speed grade
- 4
- Temperature grade
- Commercial
- Core supply (VCCINT)
- 1.2 V
- Manufacturer notice
- XCN23009
Device specifications
- Logic cells
- 46,080
- Block RAM
- 720 Kb
Specifications
- Package outline
- 900-FBGA, 31 × 31 mm
- Package / case
- 900-BBGA
- Mounting
- Surface Mount
- User I/O
- 565
- LABs / CLBs
- 5,120
- System gates
- 2,000,000
- Supply voltage
- 1.14 V to 1.26 V
- Operating temperature
- 0 °C to 85 °C (junction)
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XC3S2000 | Base Device | Spartan-3 device XC3S2000 |
| 4 | Speed Grade | Speed grade 4 |
| FGG900 | Package | 900-pin BGA (fine-pitch ball grid array, Pb-free) |
| C | Temperature Grade | Commercial |
Documentation
- XC3S2000-4FGG900C datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XC3S2000-4FG900I | Likely alternative · 83/100Leaded FG900 version of the lead-free FGG900 package. Industrial (−40 to +100 °C) covers commercial (0 to +85 °C) | FG900 | -4 | Industrial |
| XC3S2000-5FGG900C | Strong SKU alternate · 91/100Faster -5 speed grade, same device and package | FGG900 | -5 | Commercial |
| XC3S2000-4FG456C | Same device, different package | FG456 | -4 | Commercial |
| XC3S2000-4FG456I | Same device, different package | FG456 | -4 | Industrial |
| XC3S2000-4FG676C | Same device, different package | FG676 | -4 | Commercial |
| XC3S2000-4FG676I | Same device, different package | FG676 | -4 | Industrial |
| XC3S2000-4FGG456C | Same device, different package | FGG456 | -4 | Commercial |
| XC3S2000-4FGG456I | Same device, different package | FGG456 | -4 | Industrial |
| XC3S2000-5FGG456C | Same device, different package | FGG456 | -5 | Commercial |
| XC3S2000-4FGG676C | Same device, different package | FGG676 | -4 | Commercial |
| XC3S2000-4FGG676I | Same device, different package | FGG676 | -4 | Industrial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is there a direct replacement for the XC3S2000-4FGG900C?
- No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3S2000-4FGG900C. Either the remaining supply is used, or the board is revised around a current device.
- What package is the XC3S2000-4FGG900C?
- The XC3S2000-4FGG900C comes in the FGG900 package (900-FBGA, 31 × 31 mm).
- Which versions of the XC3S2000 come in industrial temperature?
- The XC3S2000-4FGG900C is not an industrial-temperature part. 5 XC3S2000 parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S2000-4FG456IXC3S2000-4FG676IXC3S2000-4FG900IXC3S2000-4FGG456IXC3S2000-4FGG676I
XC3S2000 discontinued?
We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.
XC3S2000 replacement optionsGuides and comparisons
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