FPGA Market

XC3S2000-4FG900I

AMD Xilinx Spartan-3 FPGA

46K logic cells 900-ball Industrial

AvailableLifecycle: ObsoleteNotice: XCN23009

The XC3S2000-4FG900I is an AMD Xilinx Spartan-3 FPGA based on the XC3S2000 device, with 46,080 logic cells and 720 Kb of block RAM. It comes in the FG900 package (900-FBGA, 31 × 31 mm), speed grade 4, industrial temperature (-40 °C to 100 °C, junction). It runs from a 1.2 V core supply (VCCINT). It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.

Logic cells
46,080
Block RAM
720 Kb
Pins
900
Speed grade
4
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XC3S2000-4FG900I
Base device
XC3S2000
Family
Spartan-3
Package
FG900
Pin / ball count
900
Speed grade
4
Temperature grade
Industrial
Core supply (VCCINT)
1.2 V
Product status
Obsolete
Manufacturer notice
XCN23009
ECCN
3A991D
HTS code
8542.31.0060
RoHS
Not compliant

Device specifications

Logic cells
46,080
Block RAM
720 Kb

Specifications

Package outline
900-FBGA, 31 × 31 mm
Package / case
900-BBGA
Mounting
Surface Mount
User I/O
565
LABs / CLBs
5,120
System gates
2,000,000
Supply voltage
1.14 V to 1.26 V
Operating temperature
-40 °C to 100 °C (junction)
Moisture sensitivity (MSL)
Level 3 (168 hours)
Series
Spartan-3
Last time buy
29 Jun 2024

Part number breakdown

SegmentFieldMeaning
XC3S2000Base DeviceSpartan-3 device XC3S2000
4Speed GradeSpeed grade 4
FG900Package900-pin BGA (fine-pitch ball grid array)
ITemperature GradeIndustrial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XC3S2000-4FGG900CEngineering review required · 70/100Commercial (0 to +85 °C) doesn't cover industrial (−40 to +100 °C). Lead-free FGG900 version of the leaded FG900 packageFGG900-4Commercial
XC3S2000-4FG456CSame device, different packageFG456-4Commercial
XC3S2000-4FG456ISame device, different packageFG456-4Industrial
XC3S2000-4FG676CSame device, different packageFG676-4Commercial
XC3S2000-4FG676ISame device, different packageFG676-4Industrial
XC3S2000-4FGG456CSame device, different packageFGG456-4Commercial
XC3S2000-4FGG456ISame device, different packageFGG456-4Industrial
XC3S2000-5FGG456CSame device, different packageFGG456-5Commercial
XC3S2000-4FGG676CSame device, different packageFGG676-4Commercial
XC3S2000-4FGG676ISame device, different packageFGG676-4Industrial
XC3S2000-5FGG900CSame device, different packageFGG900-5Commercial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XC3S2000-4FG900I still in production?
No. The XC3S2000-4FG900I has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
Is there a direct replacement for the XC3S2000-4FG900I?
No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3S2000-4FG900I. Either the remaining supply is used, or the board is revised around a current device.
What package is the XC3S2000-4FG900I?
The XC3S2000-4FG900I comes in the FG900 package (900-FBGA, 31 × 31 mm).
Which versions of the XC3S2000 come in industrial temperature?
The XC3S2000-4FG900I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 4 other XC3S2000 parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S2000-4FG456IXC3S2000-4FG676IXC3S2000-4FGG456IXC3S2000-4FGG676I

XC3S2000 discontinued?

We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.

XC3S2000 replacement options

Guides and comparisons

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