FPGA Market

XC3S2000-4FG676C

AMD Xilinx Spartan-3 FPGA

46K logic cells 676-ball Commercial

AvailableLifecycle: ObsoleteNotice: XCN23009

The XC3S2000-4FG676C is an AMD Xilinx Spartan-3 FPGA based on the XC3S2000 device, with 46,080 logic cells and 720 Kb of block RAM. It comes in the FG676 package (676-FBGA, 27 × 27 mm), speed grade 4, commercial temperature (0 °C to 85 °C, junction). It runs from a 1.2 V core supply (VCCINT). It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.

Logic cells
46,080
Block RAM
720 Kb
Pins
676
Speed grade
4
Temperature
Commercial

Part details

Manufacturer
AMD Xilinx
Part number
XC3S2000-4FG676C
Base device
XC3S2000
Family
Spartan-3
Package
FG676
Pin / ball count
676
Speed grade
4
Temperature grade
Commercial
Core supply (VCCINT)
1.2 V
Product status
Obsolete
Manufacturer notice
XCN23009
ECCN
3A991D
HTS code
8542.31.0060
RoHS
Not compliant

Device specifications

Logic cells
46,080
Block RAM
720 Kb

Specifications

Package outline
676-FBGA, 27 × 27 mm
Package / case
676-BGA
Mounting
Surface Mount
User I/O
489
LABs / CLBs
5,120
System gates
2,000,000
Supply voltage
1.14 V to 1.26 V
Operating temperature
0 °C to 85 °C (junction)
Moisture sensitivity (MSL)
Level 3 (168 hours)
Series
Spartan-3
Last time buy
29 Jun 2024

Part number breakdown

SegmentFieldMeaning
XC3S2000Base DeviceSpartan-3 device XC3S2000
4Speed GradeSpeed grade 4
FG676Package676-pin BGA (fine-pitch ball grid array)
CTemperature GradeCommercial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XC3S2000-4FG676IVery strong alternative · 98/100Same device, package and speed grade. Industrial (−40 to +100 °C) covers commercial (0 to +85 °C)FG676-4Industrial
XC3S2000-4FGG676CLikely alternative · 83/100Lead-free FGG676 version of the leaded FG676 packageFGG676-4Commercial
XC3S2000-4FGG676ILikely alternative · 83/100Lead-free FGG676 version of the leaded FG676 package. Industrial (−40 to +100 °C) covers commercial (0 to +85 °C)FGG676-4Industrial
XC3S2000-4FG456CSame device, different packageFG456-4Commercial
XC3S2000-4FG456ISame device, different packageFG456-4Industrial
XC3S2000-4FG900ISame device, different packageFG900-4Industrial
XC3S2000-4FGG456CSame device, different packageFGG456-4Commercial
XC3S2000-4FGG456ISame device, different packageFGG456-4Industrial
XC3S2000-5FGG456CSame device, different packageFGG456-5Commercial
XC3S2000-4FGG900CSame device, different packageFGG900-4Commercial
XC3S2000-5FGG900CSame device, different packageFGG900-5Commercial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XC3S2000-4FG676C still in production?
No. The XC3S2000-4FG676C has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
Is there a direct replacement for the XC3S2000-4FG676C?
No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3S2000-4FG676C. Either the remaining supply is used, or the board is revised around a current device.
What package is the XC3S2000-4FG676C?
The XC3S2000-4FG676C comes in the FG676 package (676-FBGA, 27 × 27 mm).
Which versions of the XC3S2000 come in industrial temperature?
The XC3S2000-4FG676C is not an industrial-temperature part. 5 XC3S2000 parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S2000-4FG676IXC3S2000-4FG456IXC3S2000-4FG900IXC3S2000-4FGG456IXC3S2000-4FGG676I

XC3S2000 discontinued?

We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.

XC3S2000 replacement options

Guides and comparisons

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