XCZU7EV-1FBVB900E
AMD Xilinx Zynq UltraScale+ MPSoC FPGA
504K system logic cells 900-ball BGA Extended
AvailableLifecycle: Active
The XCZU7EV-1FBVB900E is an AMD Xilinx Zynq UltraScale+ MPSoC FPGA based on the XCZU7EV device, with 504,000 system logic cells, 11,232 Kb of block RAM and 1,728 DSP slices. It comes in the FBVB900 package (900-FCBGA, 31 × 31 mm), speed grade -1, extended temperature (0 °C to 100 °C, junction). It runs from a 0.85 V core supply (VCCINT) and has 207 user I/O in this package. It is in active production.
- System Logic Cells
- 504,000
- Block RAM
- 11,232 Kb
- DSP slices
- 1,728
- Balls
- 900
- Speed grade
- -1
- Temperature
- Extended
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU7EV-1FBVB900E
- Base device
- XCZU7EV
- Family
- Zynq UltraScale+ MPSoC
- Package
- FBVB900
- Package type
- BGA
- Pin / ball count
- 900
- Speed grade
- -1
- Temperature grade
- Extended
- Core supply (VCCINT)
- 0.85 V
- Product status
- Active
- ECCN
- 5A002A4 XIL
- HTS code
- 8542.31.0070
- RoHS
- Compliant
Device specifications
- System Logic Cells
- 504,000
- DSP slices
- 1,728
- Block RAM
- 11,232 Kb
- User I/O (FBVB900)
- 207
- Processor
- Quad-core Arm Cortex-A53 MPCore up to 1.5 GHz
- LUTs
- 230,400
- Flip-flops
- 460,800
- Block RAM blocks (36 Kb)
- 312
- Distributed RAM
- 6.2 Mb
- UltraRAM
- 27 Mb
- Clock management tiles
- 8
Specifications
- Package outline
- 900-FCBGA, 31 × 31 mm
- Package / case
- 900-BBGA, FCBGA
- FPGA fabric
- ZynqUltraScale+ FPGA, 504K+ Logic Cells
- Architecture
- MCU, FPGA
- Processor RAM
- 256 KB
- Speed
- 500 MHz, 600 MHz, 1.2 GHz
- Interfaces
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peripherals
- DMA, WDT
- Operating temperature
- 0 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Zynq UltraScale+ MPSOC EV
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU7EV | Base Device | Zynq UltraScale+ MPSoC device XCZU7EV |
| 1 | Speed Grade | Speed grade 1 |
| FBVB900 | Package | 900-pin BGA (flip-chip ball grid array) |
| E | Temperature Grade | Extended |
Documentation
- XCZU7EV-1FBVB900I datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU7EV-1FBVB900I | Strong SKU alternate · 96/100Same device, package and speed grade. Industrial (−40 to +100 °C) covers extended (0 to +100 °C) | FBVB900 | -1 | Industrial |
| XCZU7EV-2FBVB900I | Likely alternative · 89/100Faster -2 speed grade, same device and package. Industrial (−40 to +100 °C) covers extended (0 to +100 °C) | FBVB900 | -2 | Industrial |
| XCZU7EV-2FBVB900E | Likely alternative · 89/100Faster -2 speed grade, same device and package | FBVB900 | -2 | Extended |
| XCZU7EV-3FBVB900E | Significant migration work · 45/100Needs 0.9 V VCCINT instead of 0.85 V. Faster -3 speed grade, same device and package | FBVB900 | -3 | Extended |
| XCZU4EV-1FBVB900E | Engineering review required · 55/100Smaller device (192,150 vs 504,000 logic cells). Same FBVB900 balls, but 48 I/O sit in renumbered banks: constraints change | FBVB900 | -1 | Extended |
| XCZU5EV-1FBVB900E | Engineering review required · 55/100Smaller device (256,200 vs 504,000 logic cells). Same FBVB900 balls, but 48 I/O sit in renumbered banks: constraints change | FBVB900 | -1 | Extended |
| XCZU7EV-1FFVC1156I | Same device, different package | FFVC1156 | -1 | Industrial |
| XCZU7EV-1FFVC1156E | Same device, different package | FFVC1156 | -1 | Extended |
| XCZU7EV-2FFVC1156I | Same device, different package | FFVC1156 | -2 | Industrial |
| XCZU7EV-2FFVC1156E | Same device, different package | FFVC1156 | -2 | Extended |
| XCZU7EV-1FFVF1517I | Same device, different package | FFVF1517 | -1 | Industrial |
| XCZU7EV-1FFVF1517E | Same device, different package | FFVF1517 | -1 | Extended |
| XCZU7EV-2FFVF1517I | Same device, different package | FFVF1517 | -2 | Industrial |
| XCZU7EV-2FFVF1517E | Same device, different package | FFVF1517 | -2 | Extended |
| XCZU7EV-3FFVF1517E | Same device, different package | FFVF1517 | -3 | Extended |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCZU7EV-1FBVB900E still in production?
- Yes. The XCZU7EV-1FBVB900E is in active production.
- What package is the XCZU7EV-1FBVB900E?
- The XCZU7EV-1FBVB900E comes in the FBVB900 BGA package (900-FCBGA, 31 × 31 mm).
- Which versions of the XCZU7EV come in industrial temperature?
- The XCZU7EV-1FBVB900E is not an industrial-temperature part. 6 XCZU7EV parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU7EV-1FBVB900IXCZU7EV-2FBVB900IXCZU7EV-1FFVC1156IXCZU7EV-2FFVC1156IXCZU7EV-1FFVF1517IXCZU7EV-2FFVF1517I
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