XCZU63DR-2FFVE1156I
AMD Xilinx Zynq UltraScale+ RFSoC
394K logic cells 1,156-ball BGA Industrial
AvailableLifecycle: Obsolete
The XCZU63DR-2FFVE1156I is an AMD Xilinx Zynq UltraScale+ RFSoC based on the XCZU63DR device, with 393,750 logic cells, 18,000 Kb of block RAM and 1,200 DSP slices. It comes in the FFVE1156 package (1,156 balls), speed grade -2, industrial temperature. It has 157 user I/O in this package. It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.
- Logic cells
- 393,750
- Block RAM
- 18,000 Kb
- DSP slices
- 1,200
- Balls
- 1,156
- Speed grade
- -2
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU63DR-2FFVE1156I
- Base device
- XCZU63DR
- Family
- Zynq UltraScale+ RFSoC
- Package
- FFVE1156
- Package type
- BGA
- Pin / ball count
- 1,156
- Speed grade
- -2
- Temperature grade
- Industrial
- Product status
- Obsolete
- ECCN
- 3A001.a.14
- HTS code
- 8542.31.0070
- RoHS
- Compliant
Device specifications
- Logic cells
- 393,750
- DSP slices
- 1,200
- Block RAM
- 18,000 Kb
- User I/O (FFVE1156)
- 157
- LUTs
- 180,000
- Flip-flops
- 360,000
- Block RAM blocks (36 Kb)
- 500
- Distributed RAM
- 5.4 Mb
- UltraRAM
- 37 Mb
- Clock management tiles
- 5
- GTY transceivers
- 4
Specifications
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU63DR | Base Device | Zynq UltraScale+ RFSoC device XCZU63DR |
| 2 | Speed Grade | Speed grade 2 |
| FFVE1156 | Package | 1156-pin BGA (flip-chip ball grid array) |
| I | Temperature Grade | Industrial |
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU63DR-1FFVE1156I | Same device, different speed grade | FFVE1156 | -1 | Industrial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCZU63DR-2FFVE1156I still in production?
- No. The XCZU63DR-2FFVE1156I has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
- What package is the XCZU63DR-2FFVE1156I?
- The XCZU63DR-2FFVE1156I comes in the FFVE1156 BGA package (1,156 pins).
- Which versions of the XCZU63DR come in industrial temperature?
- The XCZU63DR-2FFVE1156I is itself an industrial-temperature part. One other XCZU63DR part is industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU63DR-1FFVE1156I
Guides and comparisons
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