FPGA Market

XCZU63DR-1FFVE1156I

AMD Xilinx Zynq UltraScale+ RFSoC

394K logic cells 1,156-ball BGA Industrial

Available

The XCZU63DR-1FFVE1156I is an AMD Xilinx Zynq UltraScale+ RFSoC based on the XCZU63DR device, with 393,750 logic cells, 18,000 Kb of block RAM and 1,200 DSP slices. It comes in the FFVE1156 package (1,156 balls), speed grade -1, industrial temperature. It has 157 user I/O in this package.

Logic cells
393,750
Block RAM
18,000 Kb
DSP slices
1,200
Balls
1,156
Speed grade
-1
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XCZU63DR-1FFVE1156I
Base device
XCZU63DR
Family
Zynq UltraScale+ RFSoC
Package
FFVE1156
Package type
BGA
Pin / ball count
1,156
Speed grade
-1
Temperature grade
Industrial
ECCN
3A001.a.14
HTS code
8542310070
RoHS
Compliant

Device specifications

Logic cells
393,750
DSP slices
1,200
Block RAM
18,000 Kb
User I/O (FFVE1156)
157
LUTs
180,000
Flip-flops
360,000
Block RAM blocks (36 Kb)
500
Distributed RAM
5.4 Mb
UltraRAM
37 Mb
Clock management tiles
5
GTY transceivers
4

Part number breakdown

SegmentFieldMeaning
XCZU63DRBase DeviceZynq UltraScale+ RFSoC device XCZU63DR
1Speed GradeSpeed grade 1
FFVE1156Package1156-pin BGA (flip-chip ball grid array)
ITemperature GradeIndustrial

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XCZU63DR-2FFVE1156ISame device, different speed gradeFFVE1156-2Industrial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

What package is the XCZU63DR-1FFVE1156I?
The XCZU63DR-1FFVE1156I comes in the FFVE1156 BGA package (1,156 pins).
Which versions of the XCZU63DR come in industrial temperature?
The XCZU63DR-1FFVE1156I is itself an industrial-temperature part. One other XCZU63DR part is industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU63DR-2FFVE1156I

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