FPGA Market

XCZU4EG-1FBVB900E

AMD XilinxZynq UltraScale+ MPSoCFPGA

Part details

Manufacturer
AMD Xilinx
Part number
XCZU4EG-1FBVB900E
Base device
XCZU4EG
Family
Zynq UltraScale+ MPSoC
Package
FBVB900
Package type
BGA
Pin / ball count
900
Speed grade
-1
Temperature grade
Extended

Device specifications

System Logic Cells
192,000
DSP slices
728
Block RAM
21,094 Kb
Transceivers
16
Max transceiver rate
16.3 Gb/s
User I/O (FBVB900)
207
Processor
Quad-core Arm Cortex-A53 MPCore™ up to 1.5 GHz

Part number breakdown

SegmentFieldMeaning
XCZU4EGBase DeviceZynq UltraScale+ MPSoC device XCZU4EG
1Speed GradeSpeed grade 1
FBVB900Package900-pin BGA (flip-chip ball grid array)
ETemperature GradeExtended

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XCZU4EG-1FBVB900CSame device, commercial temperatureFBVB900-1Commercial
XCZU4EG-1FBVB900ISame device, industrial temperatureFBVB900-1Industrial
XCZU4EG-2FBVB900CSame device, different speed and temperature gradeFBVB900-2Commercial
XCZU4EG-2FBVB900ISame device, different speed and temperature gradeFBVB900-2Industrial
XCZU4EG-2FBVB900ESame device, different speed gradeFBVB900-2Extended
XCZU4EG-3FBVB900CSame device, different speed and temperature gradeFBVB900-3Commercial
XCZU4EG-1SFVC784CSame device, different packageSFVC784-1Commercial
XCZU4EG-1SFVC784ISame device, different packageSFVC784-1Industrial
XCZU4EG-1SFVC784ESame device, different packageSFVC784-1Extended
XCZU4EG-2SFVC784CSame device, different packageSFVC784-2Commercial
XCZU4EG-2SFVC784ISame device, different packageSFVC784-2Industrial
XCZU4EG-2SFVC784ESame device, different packageSFVC784-2Extended
XCZU4EG-3SFVC784CSame device, different packageSFVC784-3Commercial
XCZU4EG-3SFVC784ESame device, different packageSFVC7843Extended
XCZU4EG-L1FBVB900ISame device, different packageIndustrial
XCZU4EG-L2SFVC784ESame device, different packageExtended

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