XCZU3EG-1SFVC784I
AMD Xilinx Zynq UltraScale+ MPSoC FPGA
154K system logic cells 784-ball BGA Industrial
AvailableLifecycle: Active
The XCZU3EG-1SFVC784I is an AMD Xilinx Zynq UltraScale+ MPSoC FPGA based on the XCZU3EG device, with 154,350 system logic cells, 7,776 Kb of block RAM and 360 DSP slices. It comes in the SFVC784 package (784-FCBGA, 23 × 23 mm), speed grade -1, industrial temperature (-40 °C to 100 °C, junction). It runs from a 0.85 V core supply (VCCINT) and has 255 user I/O in this package. It is in active production.
- System Logic Cells
- 154,350
- Block RAM
- 7,776 Kb
- DSP slices
- 360
- Balls
- 784
- Speed grade
- -1
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU3EG-1SFVC784I
- Base device
- XCZU3EG
- Family
- Zynq UltraScale+ MPSoC
- Package
- SFVC784
- Package type
- BGA
- Pin / ball count
- 784
- Speed grade
- -1
- Temperature grade
- Industrial
- Core supply (VCCINT)
- 0.85 V
- Product status
- Active
- ECCN
- 5A992C
- HTS code
- 8542.31.0070
- RoHS
- Compliant
Device specifications
- System Logic Cells
- 154,350
- DSP slices
- 360
- Block RAM
- 7,776 Kb
- User I/O (SFVC784)
- 255
- Processor
- Quad-core Arm Cortex-A53 MPCore™ up to 1.5 GHz
- LUTs
- 70,560
- Flip-flops
- 141,120
- Block RAM blocks (36 Kb)
- 216
- Distributed RAM
- 1.8 Mb
- Clock management tiles
- 3
Specifications
- Package outline
- 784-FCBGA, 23 × 23 mm
- Package / case
- 784-BFBGA, FCBGA
- FPGA fabric
- ZynqUltraScale+ FPGA, 154K+ Logic Cells
- Architecture
- MCU, FPGA
- Processor RAM
- 256 KB
- Speed
- 500 MHz, 600 MHz, 1.2 GHz
- Interfaces
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peripherals
- DMA, WDT
- Operating temperature
- -40 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Zynq UltraScale+ MPSOC EG
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU3EG | Base Device | Zynq UltraScale+ MPSoC device XCZU3EG |
| 1 | Speed Grade | Speed grade 1 |
| SFVC784 | Package | 784-pin BGA (flip-chip ball grid array) |
| I | Temperature Grade | Industrial |
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU3EG-1SFVC784E | Engineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed grade | SFVC784 | -1 | Extended |
| XCZU3EG-2SFVC784I | Likely alternative · 89/100Faster -2 speed grade, same device and package | SFVC784 | -2 | Industrial |
| XCZU3EG-2SFVC784E | Engineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Faster -2 speed grade, same device and package | SFVC784 | -2 | Extended |
| XCZU2EG-1SFVC784I | Engineering review required · 55/100Smaller device (103,320 vs 154,350 logic cells). All 784 balls identical in the SFVC784 package | SFVC784 | -1 | Industrial |
| XCZU2CG-1SFVC784I | Significant migration work · 45/100Different processor: Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz. Smaller device (103,320 vs 154,350 logic cells) | SFVC784 | -1 | Industrial |
| XCZU3CG-1SFVC784I | Significant migration work · 45/100Different processor: Dual-core Arm Cortex-A53 MPCore™ up to 1.3 GHz. All 784 balls identical in the SFVC784 package | SFVC784 | -1 | Industrial |
| XCZU3EG-1SBVA484I | Same device, different package | SBVA484 | -1 | Industrial |
| XCZU3EG-1SBVA484E | Same device, different package | SBVA484 | -1 | Extended |
| XCZU3EG-2SBVA484I | Same device, different package | SBVA484 | -2 | Industrial |
| XCZU3EG-2SBVA484E | Same device, different package | SBVA484 | -2 | Extended |
| XCZU3EG-1SFVA625I | Same device, different package | SFVA625 | -1 | Industrial |
| XCZU3EG-1SFVA625E | Same device, different package | SFVA625 | -1 | Extended |
| XCZU3EG-2SFVA625I | Same device, different package | SFVA625 | -2 | Industrial |
| XCZU3EG-2SFVA625E | Same device, different package | SFVA625 | -2 | Extended |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCZU3EG-1SFVC784I still in production?
- Yes. The XCZU3EG-1SFVC784I is in active production.
- What package is the XCZU3EG-1SFVC784I?
- The XCZU3EG-1SFVC784I comes in the SFVC784 BGA package (784-FCBGA, 23 × 23 mm).
- Which versions of the XCZU3EG come in industrial temperature?
- The XCZU3EG-1SFVC784I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 5 other XCZU3EG parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU3EG-2SFVC784IXCZU3EG-1SBVA484IXCZU3EG-2SBVA484IXCZU3EG-1SFVA625IXCZU3EG-2SFVA625I
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