XCZU19EG-2FFVD1760I
AMD Xilinx Zynq UltraScale+ MPSoC FPGA
1.14M system logic cells 1,760-ball BGA Industrial
AvailableLifecycle: Active
The XCZU19EG-2FFVD1760I is an AMD Xilinx Zynq UltraScale+ MPSoC FPGA based on the XCZU19EG device, with 1,143,450 system logic cells, 35,424 Kb of block RAM and 1,968 DSP slices. It comes in the FFVD1760 package (1760-FCBGA, 42.5 × 42.5 mm), speed grade -2, industrial temperature (-40 °C to 100 °C, junction). It runs from a 0.85 V core supply (VCCINT) and has 313 user I/O in this package. It is in active production.
- System Logic Cells
- 1,143,450
- Block RAM
- 35,424 Kb
- DSP slices
- 1,968
- Balls
- 1,760
- Speed grade
- -2
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU19EG-2FFVD1760I
- Base device
- XCZU19EG
- Family
- Zynq UltraScale+ MPSoC
- Package
- FFVD1760
- Package type
- BGA
- Pin / ball count
- 1,760
- Speed grade
- -2
- Temperature grade
- Industrial
- Core supply (VCCINT)
- 0.85 V
- Product status
- Active
- ECCN
- 5A002A4 XIL
- HTS code
- 8542.31.0070
- RoHS
- Compliant
Device specifications
- System Logic Cells
- 1,143,450
- DSP slices
- 1,968
- Block RAM
- 35,424 Kb
- Max transceiver rate
- 32.75 Gb/s
- User I/O (FFVD1760)
- 313
- Processor
- Quad-core Arm Cortex-A53 MPCore™ up to 1.5 GHz
- LUTs
- 522,720
- Block RAM blocks (36 Kb)
- 984
- Distributed RAM
- 9.8 Mb
- UltraRAM
- 36 Mb
- Clock management tiles
- 11
- GTH transceivers
- 44
- GTY transceivers
- 28
Specifications
- Package outline
- 1760-FCBGA, 42.5 × 42.5 mm
- Package / case
- 1760-BBGA, FCBGA
- FPGA fabric
- ZynqUltraScale+ FPGA, 1143K+ Logic Cells
- Architecture
- MCU, FPGA
- Processor RAM
- 256 KB
- Speed
- 533 MHz, 600 MHz, 1.3 GHz
- Interfaces
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peripherals
- DMA, WDT
- Operating temperature
- -40 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Zynq UltraScale+ MPSOC EG
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU19EG | Base Device | Zynq UltraScale+ MPSoC device XCZU19EG |
| 2 | Speed Grade | Speed grade 2 |
| FFVD1760 | Package | 1760-pin BGA (flip-chip ball grid array) |
| I | Temperature Grade | Industrial |
Documentation
- XCZU19EG-1FFVB1517I datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU19EG-2FFVD1760E | Engineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed grade | FFVD1760 | -2 | Extended |
| XCZU19EG-3FFVD1760E | Significant migration work · 45/100Needs 0.9 V VCCINT instead of 0.85 V. Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C) | FFVD1760 | -3 | Extended |
| XCZU17EG-2FFVD1760I | Engineering review required · 55/100Smaller device (926,194 vs 1,143,450 logic cells). All 1,760 balls identical in the FFVD1760 package | FFVD1760 | -2 | Industrial |
| XCZU19EG-1FFVD1760I | Engineering review required · 69/100Slower -1 speed grade: timing must be re-closed | FFVD1760 | -1 | Industrial |
| XCZU19EG-1FFVD1760E | Engineering review required · 69/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Slower -1 speed grade: timing must be re-closed | FFVD1760 | -1 | Extended |
| XCZU19EG-1FFVB1517I | Same device, different package | FFVB1517 | -1 | Industrial |
| XCZU19EG-1FFVB1517E | Same device, different package | FFVB1517 | -1 | Extended |
| XCZU19EG-2FFVB1517I | Same device, different package | FFVB1517 | -2 | Industrial |
| XCZU19EG-2FFVB1517E | Same device, different package | FFVB1517 | -2 | Extended |
| XCZU19EG-3FFVB1517E | Same device, different package | FFVB1517 | -3 | Extended |
| XCZU19EG-1FFVC1760I | Same device, different package | FFVC1760 | -1 | Industrial |
| XCZU19EG-1FFVC1760E | Same device, different package | FFVC1760 | -1 | Extended |
| XCZU19EG-2FFVC1760I | Same device, different package | FFVC1760 | -2 | Industrial |
| XCZU19EG-2FFVC1760E | Same device, different package | FFVC1760 | -2 | Extended |
| XCZU19EG-3FFVC1760E | Same device, different package | FFVC1760 | -3 | Extended |
| XCZU19EG-1FFVE1924E | Same device, different package | FFVE1924 | -1 | Extended |
| XCZU19EG-2FFVE1924I | Same device, different package | FFVE1924 | -2 | Industrial |
| XCZU19EG-2FFVE1924E | Same device, different package | FFVE1924 | -2 | Extended |
| XCZU19EG-3FFVE1924E | Same device, different package | FFVE1924 | -3 | Extended |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCZU19EG-2FFVD1760I still in production?
- Yes. The XCZU19EG-2FFVD1760I is in active production.
- What package is the XCZU19EG-2FFVD1760I?
- The XCZU19EG-2FFVD1760I comes in the FFVD1760 BGA package (1760-FCBGA, 42.5 × 42.5 mm).
- Which versions of the XCZU19EG come in industrial temperature?
- The XCZU19EG-2FFVD1760I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 6 other XCZU19EG parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU19EG-1FFVD1760IXCZU19EG-1FFVB1517IXCZU19EG-2FFVB1517IXCZU19EG-1FFVC1760IXCZU19EG-2FFVC1760IXCZU19EG-2FFVE1924I
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