FPGA Market

XCZU17EG-1FFVB1517I

AMD Xilinx Zynq UltraScale+ MPSoC FPGA

926K system logic cells 1,517-ball BGA Industrial

Available

The XCZU17EG-1FFVB1517I is an AMD Xilinx Zynq UltraScale+ MPSoC FPGA based on the XCZU17EG device, with 926,194 system logic cells, 28,656 Kb of block RAM and 1,590 DSP slices. It comes in the FFVB1517 package (1517-FCBGA, 40 × 40 mm), speed grade -1, industrial temperature (-40 °C to 100 °C, junction). It runs from a 0.85 V core supply (VCCINT) and has 655 user I/O in this package.

System Logic Cells
926,194
Block RAM
28,656 Kb
DSP slices
1,590
Balls
1,517
Speed grade
-1
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XCZU17EG-1FFVB1517I
Base device
XCZU17EG
Family
Zynq UltraScale+ MPSoC
Package
FFVB1517
Package type
BGA
Pin / ball count
1,517
Speed grade
-1
Temperature grade
Industrial
Core supply (VCCINT)
0.85 V

Device specifications

System Logic Cells
926,194
DSP slices
1,590
Block RAM
28,656 Kb
Max transceiver rate
32.75 Gb/s
User I/O (FFVB1517)
655
Processor
Quad-core Arm Cortex-A53 MPCore™ up to 1.5 GHz
LUTs
423,403
Flip-flops
846,806
Block RAM blocks (36 Kb)
796
Distributed RAM
8 Mb
UltraRAM
28.7 Mb
Clock management tiles
11
GTH transceivers
44
GTY transceivers
28

Specifications

Package outline
1517-FCBGA, 40 × 40 mm
Package / case
1517-BBGA, FCBGA
FPGA fabric
ZynqUltraScale+ FPGA, 926K+ Logic Cells
Architecture
MCU, FPGA
Processor RAM
256 KB
Speed
500 MHz, 600 MHz, 1.2 GHz
Interfaces
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals
DMA, WDT
Operating temperature
-40 °C to 100 °C (junction)

Part number breakdown

SegmentFieldMeaning
XCZU17EGBase DeviceZynq UltraScale+ MPSoC device XCZU17EG
1Speed GradeSpeed grade 1
FFVB1517Package1517-pin BGA (flip-chip ball grid array)
ITemperature GradeIndustrial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XCZU17EG-1FFVB1517EEngineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed gradeFFVB1517-1Extended
XCZU17EG-2FFVB1517ILikely alternative · 89/100Faster -2 speed grade, same device and packageFFVB1517-2Industrial
XCZU17EG-2FFVB1517EEngineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Faster -2 speed grade, same device and packageFFVB1517-2Extended
XCZU19EG-1FFVB1517IEngineering review required · 71/100All 1,517 balls identical in the FFVB1517 package. Different device: the design must be rebuiltFFVB1517-1Industrial
XCZU17EG-1FFVC1760ISame device, different packageFFVC1760-1Industrial
XCZU17EG-1FFVC1760ESame device, different packageFFVC1760-1Extended
XCZU17EG-2FFVC1760ISame device, different packageFFVC1760-2Industrial
XCZU17EG-2FFVC1760ESame device, different packageFFVC1760-2Extended
XCZU17EG-1FFVD1760ISame device, different packageFFVD1760-1Industrial
XCZU17EG-1FFVD1760ESame device, different packageFFVD1760-1Extended
XCZU17EG-2FFVD1760ISame device, different packageFFVD1760-2Industrial
XCZU17EG-2FFVD1760ESame device, different packageFFVD1760-2Extended
XCZU17EG-2FFVE1924ISame device, different packageFFVE1924-2Industrial
XCZU17EG-2FFVE1924ESame device, different packageFFVE1924-2Extended

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

What package is the XCZU17EG-1FFVB1517I?
The XCZU17EG-1FFVB1517I comes in the FFVB1517 BGA package (1517-FCBGA, 40 × 40 mm).
Which versions of the XCZU17EG come in industrial temperature?
The XCZU17EG-1FFVB1517I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 6 other XCZU17EG parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCZU17EG-2FFVB1517IXCZU17EG-1FFVC1760IXCZU17EG-2FFVC1760IXCZU17EG-1FFVD1760IXCZU17EG-2FFVD1760IXCZU17EG-2FFVE1924I

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