XCXQZU15EGFF-3RB1156C
AMD XilinxZynq UltraScale+SoC FPGA
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCXQZU15EGFF-3RB1156C
- Base device
- XCXQZU15EGFF
- Family
- Zynq UltraScale+
- Package
- RB1156
- Package type
- BGA
- Pin / ball count
- 1,156
- Speed grade
- -3
- Temperature grade
- Commercial
Device specifications
- User I/O (RB1156)
- 332
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCXQZU15EGFF | Base Device | Device XCXQZU15EGFF |
| 3 | Speed Grade | Speed grade 3 |
| RB1156 | Package | 1156-pin BGA (ball grid array) |
| C | Temperature Grade | Commercial |
Related part numbers
| Part number | Relationship | Package | Speed | Temperature |
|---|---|---|---|---|
| XCXQZU15EGFF-1RB1156C | Same device, different speed grade | RB1156 | -1 | Commercial |
| XCXQZU15EGFF-1RB1156I | Same device, different speed and temperature grade | RB1156 | -1 | Industrial |
| XCXQZU15EGFF-1RB1156E | Same device, different speed and temperature grade | RB1156 | -1 | Extended |
| XCXQZU15EGFF-2RB1156C | Same device, different speed grade | RB1156 | -2 | Commercial |
| XCXQZU15EGFF-2RB1156I | Same device, different speed and temperature grade | RB1156 | -2 | Industrial |
| XCXQZU15EGFF-2RB1156E | Same device, different speed and temperature grade | RB1156 | -2 | Extended |
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