FPGA Market

XCXQZU15EGFF-1RB1156E

AMD XilinxZynq UltraScale+SoC FPGA

Part details

Manufacturer
AMD Xilinx
Part number
XCXQZU15EGFF-1RB1156E
Base device
XCXQZU15EGFF
Family
Zynq UltraScale+
Package
RB1156
Package type
BGA
Pin / ball count
1,156
Speed grade
-1
Temperature grade
Extended

Device specifications

User I/O (RB1156)
332

Part number breakdown

SegmentFieldMeaning
XCXQZU15EGFFBase DeviceDevice XCXQZU15EGFF
1Speed GradeSpeed grade 1
RB1156Package1156-pin BGA (ball grid array)
ETemperature GradeExtended

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XCXQZU15EGFF-1RB1156CSame device, commercial temperatureRB1156-1Commercial
XCXQZU15EGFF-1RB1156ISame device, industrial temperatureRB1156-1Industrial
XCXQZU15EGFF-2RB1156CSame device, different speed and temperature gradeRB1156-2Commercial
XCXQZU15EGFF-2RB1156ISame device, different speed and temperature gradeRB1156-2Industrial
XCXQZU15EGFF-2RB1156ESame device, different speed gradeRB1156-2Extended
XCXQZU15EGFF-3RB1156CSame device, different speed and temperature gradeRB1156-3Commercial

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