XCXQZU15EGFF-2RB1156I
AMD XilinxZynq UltraScale+SoC FPGA
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCXQZU15EGFF-2RB1156I
- Base device
- XCXQZU15EGFF
- Family
- Zynq UltraScale+
- Package
- RB1156
- Package type
- BGA
- Pin / ball count
- 1,156
- Speed grade
- -2
- Temperature grade
- Industrial
Device specifications
- User I/O (RB1156)
- 332
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCXQZU15EGFF | Base Device | Device XCXQZU15EGFF |
| 2 | Speed Grade | Speed grade 2 |
| RB1156 | Package | 1156-pin BGA (ball grid array) |
| I | Temperature Grade | Industrial |
Related part numbers
| Part number | Relationship | Package | Speed | Temperature |
|---|---|---|---|---|
| XCXQZU15EGFF-1RB1156C | Same device, different speed and temperature grade | RB1156 | -1 | Commercial |
| XCXQZU15EGFF-1RB1156I | Same device, different speed grade | RB1156 | -1 | Industrial |
| XCXQZU15EGFF-1RB1156E | Same device, different speed and temperature grade | RB1156 | -1 | Extended |
| XCXQZU15EGFF-2RB1156C | Same device, commercial temperature | RB1156 | -2 | Commercial |
| XCXQZU15EGFF-2RB1156E | Same device, extended temperature | RB1156 | -2 | Extended |
| XCXQZU15EGFF-3RB1156C | Same device, different speed and temperature grade | RB1156 | -3 | Commercial |
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