XCV812E-8BG560C
AMD Xilinx Virtex-EM 1.8V FPGA
21K logic cells 560-ball Commercial
The XCV812E-8BG560C is an AMD Xilinx Virtex-EM 1.8V FPGA based on the XCV812E device, with 21,168 logic cells and 1,120 Kb of block RAM. It comes in the BG560 package (560-MBGA, 42.5 × 42.5 mm), speed grade 8, commercial temperature (0 °C to 85 °C, junction). It has been discontinued by the manufacturer. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.
- Logic cells
- 21,168
- Block RAM
- 1,120 Kb
- Pins
- 560
- Speed grade
- 8
- Temperature
- Commercial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCV812E-8BG560C
- Base device
- XCV812E
- Family
- Virtex-EM 1.8V
- Package
- BG560
- Pin / ball count
- 560
- Speed grade
- 8
- Temperature grade
- Commercial
- Product status
- Obsolete
- ECCN
- 3A991D
- HTS code
- 8542.31.0060
- RoHS
- Not compliant
Device specifications
- Logic cells
- 21,168
- Block RAM
- 1,120 Kb
Specifications
- Package outline
- 560-MBGA, 42.5 × 42.5 mm
- Package / case
- 560-LBGA Exposed Pad, Metal
- Mounting
- Surface Mount
- User I/O
- 404
- LABs / CLBs
- 4,704
- System gates
- 254,016
- Supply voltage
- 1.71 V to 1.89 V
- Operating temperature
- 0 °C to 85 °C (junction)
- Moisture sensitivity (MSL)
- Level 3 (168 hours)
- Series
- Virtex-E EM
- Last time buy
- 20 May 2013
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCV812E | Base Device | Device XCV812E |
| 8 | Speed Grade | Speed grade 8 |
| BG560 | Package | 560-pin BGA (ball grid array) |
| C | Temperature Grade | Commercial |
Documentation
- XCV812E-7BG560C datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCV812E-6BG560C | Same device, different speed grade | BG560 | -6 | Commercial |
| XCV812E-7BG560C | Same device, different speed grade | BG560 | -7 | Commercial |
| XCV812E-7FG900C | Same device, different package | FG900 | -7 | Commercial |
| XCV812E-8FG900C | Same device, different package | FG900 | -8 | Commercial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCV812E-8BG560C still in production?
- No. The XCV812E-8BG560C has been discontinued by the manufacturer. Discontinued parts can still be quoted — send a request with the quantity and any date-code requirements.
- What package is the XCV812E-8BG560C?
- The XCV812E-8BG560C comes in the BG560 package (560-MBGA, 42.5 × 42.5 mm).
XCV812E discontinued?
We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.
XCV812E replacement optionsGuides and comparisons
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