FPGA Market

Obsolete device

XCV812E replacement options

The AMD Xilinx XCV812E has been discontinued by the manufacturer. There are two ways forward, and for most people reading this the first one is the answer: keep the design and source the part. Changing device means a board revision, so it is only worth it if you are redesigning anyway.

1. Keep the design — source the XCV812E

Discontinued parts are still traded. We hold 5 orderable XCV812E parts — send the exact code and quantity and we'll come back with stock and pricing, including date-code and traceability requirements.

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Part numberPackagePinsSpeedTemperature
XCV812E-6BG560CBG5605606Commercial
XCV812E-7BG560CBG5605607Commercial
XCV812E-8BG560CBG5605608Commercial
XCV812E-7FG900CFG9007Commercial
XCV812E-8FG900CFG9008Commercial

A different package or speed grade of the same device is the closest thing to a like-for-like change: the silicon is the same, so only the footprint or timing differs. It still needs checking against your board.

2. Redesigning? Current devices of similar capacity

AMD Xilinx devices still in production with comparable logic capacity, closest first. These are a shortlist to evaluate, not equivalents: none of them is pin-compatible with the XCV812E, and none is recommended by the manufacturer as its successor. We select them by capacity from the data on this site.

DeviceFamilyLogic cellsvs XCV812EBlock RAMDSPParts
XCV812EVirtex-EM 1.8V21,168The original1,120 Kb5
XCSU25PSpartan UltraScale+21,8751.0× the logic cells1,728 Kb364
XC7S25Spartan-723,3601.1× the logic cells1,620 Kb8015
XC7A25TArtix-723,3601.1× the logic cells1,620 Kb809
XA7A25TArtix-723,3601.1× the logic cells1,620 Kb6
XA7S25Spartan-723,3601.1× the logic cells1,620 Kb806
XC7A35TArtix-733,2801.6× the logic cells1,800 Kb9028

What to check before changing device

  • Footprint and pinout

    Ball count, pitch and pin assignment all differ between families. A new device means a new layout.

  • I/O voltages and banks

    Supported I/O standards, bank voltages and the number of banks change between generations.

  • Core and I/O supplies

    Newer devices usually run a lower core voltage and need a different power tree.

  • Configuration

    Flash type, configuration mode and boot timing are family-specific.

  • Tools and IP

    The design has to be rebuilt in the current toolchain, and IP cores may need replacing or re-licensing.

  • Temperature and lifetime

    Check the grade you need exists, and how long the new family is expected to stay in production.

Where a design cannot be revised — certified equipment, long-life industrial and defence builds — sourcing the original is normally the cheaper route, even at obsolete pricing.

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