FPGA Market

XCKU3P-2FFVD900E

AMD XilinxKintex UltraScale+FPGA

Part details

Manufacturer
AMD Xilinx
Part number
XCKU3P-2FFVD900E
Base device
XCKU3P
Family
Kintex UltraScale+
Package
FFVD900
Package type
BGA
Pin / ball count
900
Speed grade
-2
Temperature grade
Extended

Device specifications

User I/O (FFVD900)
308

Part number breakdown

SegmentFieldMeaning
XCKU3PBase DeviceKintex UltraScale+ device XCKU3P
2Speed GradeSpeed grade 2
FFVD900Package900-pin BGA (flip-chip ball grid array)
ETemperature GradeExtended

Related part numbers

Part numberRelationshipPackageSpeedTemperature
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XCKU3P-1FFVA676ISame device, different packageFFVA676-1Industrial
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XCKU3P-2FFVA676ISame device, different packageFFVA676-2Industrial
XCKU3P-2FFVA676ESame device, different packageFFVA676-2Extended
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XCKU3P-1FFVB676ESame device, different packageFFVB676-1Extended
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XCKU3P-2FFVB676ISame device, different packageFFVB676-2Industrial
XCKU3P-2FFVB676ESame device, different packageFFVB676-2Extended
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XCKU3P-1FFVD900CSame device, different speed and temperature gradeFFVD900-1Commercial
XCKU3P-1FFVD900ISame device, different speed and temperature gradeFFVD900-1Industrial
XCKU3P-1FFVD900ESame device, different speed gradeFFVD900-1Extended
XCKU3P-2FFVD900CSame device, commercial temperatureFFVD900-2Commercial
XCKU3P-2FFVD900ISame device, industrial temperatureFFVD900-2Industrial
XCKU3P-3FFVD900CSame device, different speed and temperature gradeFFVD900-3Commercial
XCKU3P-1SFVB784CSame device, different packageSFVB784-1Commercial
XCKU3P-1SFVB784ISame device, different packageSFVB784-1Industrial
XCKU3P-1SFVB784ESame device, different packageSFVB784-1Extended
XCKU3P-2SFVB784CSame device, different packageSFVB784-2Commercial
XCKU3P-2SFVB784ISame device, different packageSFVB784-2Industrial
XCKU3P-2SFVB784ESame device, different packageSFVB784-2Extended
XCKU3P-3SFVB784CSame device, different packageSFVB784-3Commercial

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