XCKU3P-1FFVD900I
AMD Xilinx Kintex UltraScale+ FPGA
356K logic cells 900-ball BGA Industrial
AvailableLifecycle: Active
The XCKU3P-1FFVD900I is an AMD Xilinx Kintex UltraScale+ FPGA based on the XCKU3P device, with 355,950 logic cells, 12,960 Kb of block RAM and 1,368 DSP slices. It comes in the FFVD900 package (900-FCBGA, 31 × 31 mm), speed grade -1, industrial temperature (-40 °C to 100 °C, junction). It runs from a 0.85 V core supply (VCCINT) and has 308 user I/O in this package. It is in active production.
- Logic cells
- 355,950
- Block RAM
- 12,960 Kb
- DSP slices
- 1,368
- Balls
- 900
- Speed grade
- -1
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCKU3P-1FFVD900I
- Base device
- XCKU3P
- Family
- Kintex UltraScale+
- Package
- FFVD900
- Package type
- BGA
- Pin / ball count
- 900
- Speed grade
- -1
- Temperature grade
- Industrial
- Core supply (VCCINT)
- 0.85 V
- Product status
- Active
- ECCN
- 3A991D
- HTS code
- 8542.31.0060
- RoHS
- Compliant
Device specifications
- Logic cells
- 355,950
- DSP slices
- 1,368
- Block RAM
- 12,960 Kb
- User I/O (FFVD900)
- 308
- LUTs
- 162,720
- Flip-flops
- 325,440
- Block RAM blocks (36 Kb)
- 360
- Distributed RAM
- 4.7 Mb
- UltraRAM
- 13.5 Mb
Specifications
- Package outline
- 900-FCBGA, 31 × 31 mm
- Package / case
- 900-BBGA, FCBGA
- Mounting
- Surface Mount
- LABs / CLBs
- 20,340
- Supply voltage
- 0.825 V to 0.876 V
- Operating temperature
- -40 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Kintex UltraScale+
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCKU3P | Base Device | Kintex UltraScale+ device XCKU3P |
| 1 | Speed Grade | Speed grade 1 |
| FFVD900 | Package | 900-pin BGA (flip-chip ball grid array) |
| I | Temperature Grade | Industrial |
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCKU3P-1FFVD900E | Engineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed grade | FFVD900 | -1 | Extended |
| XCKU3P-2FFVD900I | Likely alternative · 89/100Faster -2 speed grade, same device and package | FFVD900 | -2 | Industrial |
| XCKU3P-2FFVD900E | Engineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Faster -2 speed grade, same device and package | FFVD900 | -2 | Extended |
| XCKU5P-1FFVD900I | Engineering review required · 71/100All 900 balls identical in the FFVD900 package. Different device: the design must be rebuilt | FFVD900 | -1 | Industrial |
| XCKU3P-1FFVA676E | Same device, different package | FFVA676 | -1 | Extended |
| XCKU3P-2FFVA676I | Same device, different package | FFVA676 | -2 | Industrial |
| XCKU3P-2FFVA676E | Same device, different package | FFVA676 | -2 | Extended |
| XCKU3P-3FFVA676E | Same device, different package | FFVA676 | -3 | Extended |
| XCKU3P-1FFVB676I | Same device, different package | FFVB676 | -1 | Industrial |
| XCKU3P-1FFVB676E | Same device, different package | FFVB676 | -1 | Extended |
| XCKU3P-2FFVB676I | Same device, different package | FFVB676 | -2 | Industrial |
| XCKU3P-2FFVB676E | Same device, different package | FFVB676 | -2 | Extended |
| XCKU3P-3FFVB676E | Same device, different package | FFVB676 | -3 | Extended |
| XCKU3P-1SFVB784I | Same device, different package | SFVB784 | -1 | Industrial |
| XCKU3P-1SFVB784E | Same device, different package | SFVB784 | -1 | Extended |
| XCKU3P-2SFVB784I | Same device, different package | SFVB784 | -2 | Industrial |
| XCKU3P-2SFVB784E | Same device, different package | SFVB784 | -2 | Extended |
| XCKU3P-L1SFVB784I | Same device, different package | Industrial | ||
| XCKU3P-L1FFVD900I | Same device, different package | Industrial | ||
| XCKU3P-L1FFVB676I | Same device, different package | Industrial | ||
| XCKU3P-L2SFVB784E | Same device, different package | Extended | ||
| XCKU3P-L2FFVB676E | Same device, different package | Extended |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCKU3P-1FFVD900I still in production?
- Yes. The XCKU3P-1FFVD900I is in active production.
- What package is the XCKU3P-1FFVD900I?
- The XCKU3P-1FFVD900I comes in the FFVD900 BGA package (900-FCBGA, 31 × 31 mm).
- Which versions of the XCKU3P come in industrial temperature?
- The XCKU3P-1FFVD900I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 9 other XCKU3P parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCKU3P-2FFVD900IXCKU3P-2FFVA676IXCKU3P-1FFVB676IXCKU3P-2FFVB676IXCKU3P-1SFVB784IXCKU3P-2SFVB784IXCKU3P-L1SFVB784IXCKU3P-L1FFVD900Iand 1 more
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