XCKU13P-3FFVE900C
AMD XilinxKintex UltraScale+FPGA
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCKU13P-3FFVE900C
- Base device
- XCKU13P
- Family
- Kintex UltraScale+
- Package
- FFVE900
- Package type
- BGA
- Pin / ball count
- 900
- Speed grade
- -3
- Temperature grade
- Commercial
Device specifications
- User I/O (FFVE900)
- 308
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCKU13P | Base Device | Kintex UltraScale+ device XCKU13P |
| 3 | Speed Grade | Speed grade 3 |
| FFVE900 | Package | 900-pin BGA (flip-chip ball grid array) |
| C | Temperature Grade | Commercial |
Related part numbers
| Part number | Relationship | Package | Speed | Temperature |
|---|---|---|---|---|
| XCKU13P-1FFVE900C | Same device, different speed grade | FFVE900 | -1 | Commercial |
| XCKU13P-1FFVE900I | Same device, different speed and temperature grade | FFVE900 | -1 | Industrial |
| XCKU13P-1FFVE900E | Same device, different speed and temperature grade | FFVE900 | -1 | Extended |
| XCKU13P-2FFVE900C | Same device, different speed grade | FFVE900 | -2 | Commercial |
| XCKU13P-2FFVE900I | Same device, different speed and temperature grade | FFVE900 | -2 | Industrial |
| XCKU13P-2FFVE900E | Same device, different speed and temperature grade | FFVE900 | -2 | Extended |
| XCKU13P-3FFVE900E | Same device, different speed and temperature grade | FFVE900 | 3 | Extended |
| XCKU13P-L1FFVE900I | Same device, different package | Industrial | ||
| XCKU13P-L2FFVE900E | Same device, different package | Extended |
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