XCKU13P-1FFVE900I
AMD Xilinx Kintex UltraScale+ FPGA
747K logic cells 900-ball BGA Industrial
AvailableLifecycle: Active
The XCKU13P-1FFVE900I is an AMD Xilinx Kintex UltraScale+ FPGA based on the XCKU13P device, with 746,550 logic cells, 26,784 Kb of block RAM and 3,528 DSP slices. It comes in the FFVE900 package (900-FCBGA, 31 × 31 mm), speed grade -1, industrial temperature (-40 °C to 100 °C, junction). It runs from a 0.85 V core supply (VCCINT) and has 308 user I/O in this package. It is in active production.
- Logic cells
- 746,550
- Block RAM
- 26,784 Kb
- DSP slices
- 3,528
- Balls
- 900
- Speed grade
- -1
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCKU13P-1FFVE900I
- Base device
- XCKU13P
- Family
- Kintex UltraScale+
- Package
- FFVE900
- Package type
- BGA
- Pin / ball count
- 900
- Speed grade
- -1
- Temperature grade
- Industrial
- Core supply (VCCINT)
- 0.85 V
- Product status
- Active
- ECCN
- 3A991D
- HTS code
- 8542.31.0060
- RoHS
- Compliant
Device specifications
- Logic cells
- 746,550
- DSP slices
- 3,528
- Block RAM
- 26,784 Kb
- User I/O (FFVE900)
- 308
- LUTs
- 341,280
- Flip-flops
- 682,560
- Block RAM blocks (36 Kb)
- 744
- Distributed RAM
- 11.3 Mb
- UltraRAM
- 31.5 Mb
Specifications
- Package outline
- 900-FCBGA, 31 × 31 mm
- Package / case
- 900-BBGA, FCBGA
- Mounting
- Surface Mount
- LABs / CLBs
- 42,660
- Supply voltage
- 0.825 V to 0.876 V
- Operating temperature
- -40 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 4 (72 hours)
- Series
- Kintex UltraScale+
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCKU13P | Base Device | Kintex UltraScale+ device XCKU13P |
| 1 | Speed Grade | Speed grade 1 |
| FFVE900 | Package | 900-pin BGA (flip-chip ball grid array) |
| I | Temperature Grade | Industrial |
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XCKU13P-1FFVE900E | Engineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed grade | FFVE900 | -1 | Extended |
| XCKU13P-2FFVE900I | Likely alternative · 89/100Faster -2 speed grade, same device and package | FFVE900 | -2 | Industrial |
| XCKU13P-2FFVE900E | Engineering review required · 70/100Extended (0 to +100 °C) doesn't cover industrial (−40 to +100 °C). Faster -2 speed grade, same device and package | FFVE900 | -2 | Extended |
| XCKU9P-1FFVE900I | Engineering review required · 55/100Smaller device (599,550 vs 746,550 logic cells). All 900 balls identical in the FFVE900 package | FFVE900 | -1 | Industrial |
| XCKU13P-L1FFVE900I | Same device, different package | Industrial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XCKU13P-1FFVE900I still in production?
- Yes. The XCKU13P-1FFVE900I is in active production.
- What package is the XCKU13P-1FFVE900I?
- The XCKU13P-1FFVE900I comes in the FFVE900 BGA package (900-FCBGA, 31 × 31 mm).
- Which versions of the XCKU13P come in industrial temperature?
- The XCKU13P-1FFVE900I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 2 other XCKU13P parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XCKU13P-2FFVE900IXCKU13P-L1FFVE900I
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