FPGA Market

AMD Xilinx · Zynq-7000 SoC FPGA

XC7Z007S

XC7Z007S is a base device. Each orderable part adds a package, speed grade and temperature grade: 8 parts are listed below. Send the exact part number and quantity and we'll come back with price, availability and lead time.

Logic Cells
23,000
DSP slices
60
Block RAM
1,843 Kb
Packages
2
Parts
8

Specifications

Manufacturer
AMD Xilinx
Family
Zynq-7000
Product type
SoC FPGA
Logic Cells
23,000
DSP slices
60
Block RAM
1,843 Kb

XC7Z007S orderable part numbers

Part numberPackagePinsSpeedTemperatureStatus
XC7Z007S-1CLG225CCLG225225-1CommercialCheck availability
XC7Z007S-1CLG225ICLG225225-1IndustrialActiveCheck availability
XC7Z007S-2CLG225ICLG225225-2IndustrialActiveCheck availability
XC7Z007S-2CLG225ECLG2252252ExtendedActiveCheck availability
XC7Z007S-1CLG400CCLG400400-1CommercialActiveCheck availability
XC7Z007S-1CLG400ICLG400400-1IndustrialActiveCheck availability
XC7Z007S-2CLG400ICLG400400-2IndustrialActiveCheck availability
XC7Z007S-2CLG400ECLG4004002ExtendedActiveCheck availability

Package options

User I/O is given per package rather than as a device maximum, because it differs between packages.

PackageTypeBalls / PinsUser I/O
CLG225CSP22554
CLG400CSP400100

Other Zynq-7000 devices

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