FPGA Market

XC6VLX550T-3FF1760C

AMD XilinxVirtex-6FPGA

Part details

Manufacturer
AMD Xilinx
Part number
XC6VLX550T-3FF1760C
Base device
XC6VLX550T
Family
Virtex-6
Package
FF1760
Package type
BGA
Pin / ball count
1,760
Speed grade
-3
Temperature grade
Commercial

Device specifications

Logic Cells
549,888
Block RAM
22,752 Kb

Part number breakdown

SegmentFieldMeaning
XC6VLX550TBase DeviceVirtex-6 device XC6VLX550T
3Speed GradeSpeed grade 3
FF1760Package1760-pin BGA (flip-chip ball grid array)
CTemperature GradeCommercial

Documentation

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XC6VLX550T-1FF1759CSame device, different packageFF1759-1Commercial
XC6VLX550T-1FF1759ISame device, different packageFF1759-1Industrial
XC6VLX550T-1LFF1759CSame device, different packageFF1759-1LCommercial
XC6VLX550T-1LFF1759ISame device, different packageFF1759-1LIndustrial
XC6VLX550T-2FF1759CSame device, different packageFF1759-2Commercial
XC6VLX550T-2FF1759ISame device, different packageFF1759-2Industrial
XC6VLX550T-3FF1759CSame device, different packageFF1759-3Commercial
XC6VLX550T-1FF1760CSame device, different speed gradeFF1760-1Commercial
XC6VLX550T-1FF1760ISame device, different speed and temperature gradeFF1760-1Industrial
XC6VLX550T-1LFF1760CSame device, different speed gradeFF1760-1LCommercial
XC6VLX550T-1LFF1760ISame device, different speed and temperature gradeFF1760-1LIndustrial
XC6VLX550T-2FF1760CSame device, different speed gradeFF1760-2Commercial
XC6VLX550T-2FF1760ISame device, different speed and temperature gradeFF1760-2Industrial

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