XC6SLX25T-3FGG484I
AMD Xilinx Spartan-6 FPGA
24K logic cells 484-ball BGA Industrial
The XC6SLX25T-3FGG484I is an AMD Xilinx Spartan-6 FPGA based on the XC6SLX25T device, with 24,051 logic cells, 936 Kb of block RAM and 38 DSP slices. It comes in the FGG484 package (484-FBGA, 23 × 23 mm), speed grade 3, industrial temperature (-40 °C to 100 °C, junction). It runs from a 1.2 V core supply (VCCINT) and has 250 user I/O in this package. It is in active production.
- Logic Cells
- 24,051
- Block RAM
- 936 Kb
- DSP slices
- 38
- Balls
- 484
- Speed grade
- 3
- Temperature
- Industrial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XC6SLX25T-3FGG484I
- Base device
- XC6SLX25T
- Family
- Spartan-6
- Package
- FGG484
- Package type
- BGA
- Pin / ball count
- 484
- Speed grade
- 3
- Temperature grade
- Industrial
- Core supply (VCCINT)
- 1.2 V
- Product status
- Active
- ECCN
- 3A991D
- HTS code
- 8542.31.0060
- RoHS
- Compliant
Device specifications
- Logic Cells
- 24,051
- DSP slices
- 38
- Block RAM
- 936 Kb
- Transceivers
- 2
- Max transceiver rate
- 3.2 Gb/s
- User I/O (FGG484)
- 250
Specifications
- Package outline
- 484-FBGA, 23 × 23 mm
- Package / case
- 484-BBGA
- Mounting
- Surface Mount
- LABs / CLBs
- 1,879
- Supply voltage
- 1.14 V to 1.26 V
- Operating temperature
- -40 °C to 100 °C (junction)
- Moisture sensitivity (MSL)
- Level 3 (168 hours)
- Series
- Spartan-6 LXT
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XC6SLX25T | Base Device | Spartan-6 device XC6SLX25T |
| 3 | Speed Grade | Speed grade 3 |
| FGG484 | Package | 484-pin BGA (fine-pitch ball grid array, Pb-free) |
| I | Temperature Grade | Industrial |
Documentation
- XC6SLX25T-2CSG324C datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XC6SLX25T-3FGG484C | Engineering review required · 70/100Commercial (0 to +85 °C) doesn't cover industrial (−40 to +100 °C). Same device, package and speed grade | FGG484 | -3 | Commercial |
| XC6SLX25T-3FG484I | Likely alternative · 83/100Leaded FG484 version of the lead-free FGG484 package | FG484 | -3 | Industrial |
| XC6SLX25T-2FGG484C | Engineering review required · 69/100Commercial (0 to +85 °C) doesn't cover industrial (−40 to +100 °C). Slower -2 speed grade: timing must be re-closed | FGG484 | -2 | Commercial |
| XC6SLX25T-2FGG484I | Engineering review required · 69/100Slower -2 speed grade: timing must be re-closed | FGG484 | -2 | Industrial |
| XC6SLX25T-2CSG324C | Same device, different package | CSG324 | -2 | Commercial |
| XC6SLX25T-2CSG324I | Same device, different package | CSG324 | -2 | Industrial |
| XC6SLX25T-3CSG324C | Same device, different package | CSG324 | -3 | Commercial |
| XC6SLX25T-3CSG324I | Same device, different package | CSG324 | -3 | Industrial |
| XC6SLX25T-4CSG324C | Same device, different package | CSG324 | -4 | Commercial |
| XC6SLX25T-2FG484C | Same device, different package | FG484 | -2 | Commercial |
| XC6SLX25T-2FG484I | Same device, different package | FG484 | -2 | Industrial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XC6SLX25T-3FGG484I still in production?
- Yes. The XC6SLX25T-3FGG484I is in active production.
- What package is the XC6SLX25T-3FGG484I?
- The XC6SLX25T-3FGG484I comes in the FGG484 BGA package (484-FBGA, 23 × 23 mm).
- Which versions of the XC6SLX25T come in industrial temperature?
- The XC6SLX25T-3FGG484I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 5 other XC6SLX25T parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC6SLX25T-2FGG484IXC6SLX25T-2CSG324IXC6SLX25T-3CSG324IXC6SLX25T-2FG484IXC6SLX25T-3FG484I
XC6SLX25T discontinued?
We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.
XC6SLX25T replacement optionsGuides and comparisons
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