XC3SD3400A-4FGG676C
AMD Xilinx Spartan-3 FPGA
54K logic cells 676-ball Commercial
AvailableNotice: XCN23009
The XC3SD3400A-4FGG676C is an AMD Xilinx Spartan-3 FPGA based on the XC3SD3400A device, with 53,712 logic cells and 2,268 Kb of block RAM. It comes in the FGG676 package (676-FBGA, 27 × 27 mm), speed grade 4, commercial temperature (0 °C to 85 °C, junction).
- Logic cells
- 53,712
- Block RAM
- 2,268 Kb
- Pins
- 676
- Speed grade
- 4
- Temperature
- Commercial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XC3SD3400A-4FGG676C
- Base device
- XC3SD3400A
- Family
- Spartan-3
- Package
- FGG676
- Pin / ball count
- 676
- Speed grade
- 4
- Temperature grade
- Commercial
- Manufacturer notice
- XCN23009
Device specifications
- Logic cells
- 53,712
- Block RAM
- 2,268 Kb
Specifications
- Package outline
- 676-FBGA, 27 × 27 mm
- Package / case
- 676-BGA
- Mounting
- Surface Mount
- User I/O
- 469
- LABs / CLBs
- 5,968
- System gates
- 3,400,000
- Supply voltage
- 1.14 V to 1.26 V
- Operating temperature
- 0 °C to 85 °C (junction)
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XC3SD3400A | Base Device | Spartan-3 device XC3SD3400A |
| 4 | Speed Grade | Speed grade 4 |
| FGG676 | Package | 676-pin BGA (fine-pitch ball grid array, Pb-free) |
| C | Temperature Grade | Commercial |
Documentation
- XC3SD3400A-4FGG676C datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XC3SD3400A-4CS484C | Same device, different package | CS484 | -4 | Commercial |
| XC3SD3400A-4CS484I | Same device, different package | CS484 | -4 | Industrial |
| XC3SD3400A-5CS484C | Same device, different package | CS484 | -5 | Commercial |
| XC3SD3400A-4CSG484C | Same device, different package | CSG484 | -4 | Commercial |
| XC3SD3400A-4CSG484I | Same device, different package | CSG484 | -4 | Industrial |
| XC3SD3400A-5CSG484C | Same device, different package | CSG484 | -5 | Commercial |
| XC3SD3400A-4FG676C | Same device, different package | FG676 | -4 | Commercial |
| XC3SD3400A-4FG676I | Same device, different package | FG676 | -4 | Industrial |
| XC3SD3400A-5FG676C | Same device, different package | FG676 | -5 | Commercial |
| XC3SD3400A-4FGG676I | Same device, industrial temperature | FGG676 | -4 | Industrial |
| XC3SD3400A-5FGG676C | Same device, different speed grade | FGG676 | -5 | Commercial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is there a direct replacement for the XC3SD3400A-4FGG676C?
- No. The manufacturer's discontinuation notice states there is no direct replacement for the XC3SD3400A-4FGG676C. Either the remaining supply is used, or the board is revised around a current device.
- What package is the XC3SD3400A-4FGG676C?
- The XC3SD3400A-4FGG676C comes in the FGG676 package (676-FBGA, 27 × 27 mm).
- Which versions of the XC3SD3400A come in industrial temperature?
- The XC3SD3400A-4FGG676C is not an industrial-temperature part. 4 XC3SD3400A parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3SD3400A-4FGG676IXC3SD3400A-4CS484IXC3SD3400A-4CSG484IXC3SD3400A-4FG676I
XC3SD3400A discontinued?
We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.
XC3SD3400A replacement optionsGuides and comparisons
Need XC3SD3400A-4FGG676C?
Send the quantity and we'll check current market availability, pricing and lead time.
Check Stock & Pricing