FPGA Market

Obsolete device

XC3SD3400A replacement options

The AMD Xilinx XC3SD3400A has been discontinued by the manufacturer. There are two ways forward, and for most people reading this the first one is the answer: keep the design and source the part. Changing device means a board revision, so it is only worth it if you are redesigning anyway.

What the manufacturer says

AMD Xilinx's discontinuation notice lists no direct replacement for all 6 XC3SD3400A parts it covers. Where the manufacturer offers nothing equivalent, the remaining supply is the only way to keep the board unchanged.

From the manufacturer's discontinuation notice: Product Discontinuation Notice for XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II,

1. Keep the design — source the XC3SD3400A

Discontinued parts are still traded. We hold 12 orderable XC3SD3400A parts — send the exact code and quantity and we'll come back with stock and pricing, including date-code and traceability requirements.

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Part numberPackagePinsSpeedTemperature
XC3SD3400A-4CS484CCS4844844Commercial
XC3SD3400A-4CS484ICS4844844Industrial
XC3SD3400A-5CS484CCS4845Commercial
XC3SD3400A-4CSG484CCSG4844844Commercial
XC3SD3400A-4CSG484ICSG4844844Industrial
XC3SD3400A-5CSG484CCSG4844845Commercial
XC3SD3400A-4FG676CFG6766764Commercial
XC3SD3400A-4FG676IFG6766764Industrial
XC3SD3400A-5FG676CFG6765Commercial
XC3SD3400A-4FGG676CFGG6766764Commercial
XC3SD3400A-4FGG676IFGG6766764Industrial
XC3SD3400A-5FGG676CFGG6766765Commercial

A different package or speed grade of the same device is the closest thing to a like-for-like change: the silicon is the same, so only the footprint or timing differs. It still needs checking against your board.

2. Redesigning? Current devices of similar capacity

AMD Xilinx devices still in production with comparable logic capacity, closest first. These are a shortlist to evaluate, not equivalents: none of them is pin-compatible with the XC3SD3400A, and none is recommended by the manufacturer as its successor. We select them by capacity from the data on this site.

DeviceFamilyLogic cellsvs XC3SD3400ABlock RAMDSPParts
XC3SD3400ASpartan-353,712The original2,268 Kb12
XC7K70TKintex-765,6001.2× the logic cells4,860 Kb24013
XCSU60PSpartan UltraScale+65,6251.2× the logic cells3,456 Kb1446
XC7A75TArtix-775,5201.4× the logic cells3,780 Kb18022
XA7A75TArtix-775,5201.4× the logic cells3,780 Kb5
XC7S75Spartan-776,8001.4× the logic cells4,230 Kb14010
XA7S75Spartan-776,8001.4× the logic cells3,240 Kb1403

What to check before changing device

  • Footprint and pinout

    Ball count, pitch and pin assignment all differ between families. A new device means a new layout.

  • I/O voltages and banks

    Supported I/O standards, bank voltages and the number of banks change between generations.

  • Core and I/O supplies

    Newer devices usually run a lower core voltage and need a different power tree.

  • Configuration

    Flash type, configuration mode and boot timing are family-specific.

  • Tools and IP

    The design has to be rebuilt in the current toolchain, and IP cores may need replacing or re-licensing.

  • Temperature and lifetime

    Check the grade you need exists, and how long the new family is expected to stay in production.

Where a design cannot be revised — certified equipment, long-life industrial and defence builds — sourcing the original is normally the cheaper route, even at obsolete pricing.

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