XC3S50AN-4FTG256C
AMD Xilinx Spartan-3 FPGA
2K logic cells 256-ball Commercial
The XC3S50AN-4FTG256C is an AMD Xilinx Spartan-3 FPGA based on the XC3S50AN device, with 1,584 logic cells and 54 Kb of block RAM. It comes in the FTG256 package (256-FTBGA, 17 × 17 mm), speed grade 4, commercial temperature (0 °C to 85 °C, junction). The manufacturer has announced end of life for this part. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.
- Logic cells
- 1,584
- Block RAM
- 54 Kb
- Pins
- 256
- Speed grade
- 4
- Temperature
- Commercial
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XC3S50AN-4FTG256C
- Base device
- XC3S50AN
- Family
- Spartan-3
- Package
- FTG256
- Pin / ball count
- 256
- Speed grade
- 4
- Temperature grade
- Commercial
- Product status
- End of Life
Device specifications
- Logic cells
- 1,584
- Block RAM
- 54 Kb
Specifications
- Package outline
- 256-FTBGA, 17 × 17 mm
- Package / case
- 256-LBGA
- Mounting
- Surface Mount
- User I/O
- 195
- LABs / CLBs
- 176
- System gates
- 50,000
- Supply voltage
- 1.14 V to 1.26 V
- Operating temperature
- 0 °C to 85 °C (junction)
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XC3S50AN | Base Device | Spartan-3 device XC3S50AN |
| 4 | Speed Grade | Speed grade 4 |
| FTG256 | Package | 256-pin BGA (thin fine-pitch ball grid array, Pb-free) |
| C | Temperature Grade | Commercial |
Documentation
- XC3S50AN-4FTG256C datasheetAMD Xilinx document
Alternatives and other versions
| Part number | How it compares | Package | Speed | Temperature |
|---|---|---|---|---|
| XC3S50AN-4FT256C | Same device, different package | FT256 | -4 | Commercial |
| XC3S50AN-4FT256I | Same device, different package | FT256 | -4 | Industrial |
| XC3S50AN-5FT256C | Same device, different package | FT256 | -5 | Commercial |
| XC3S50AN-4FTG256I | Same device, industrial temperature | FTG256 | -4 | Industrial |
| XC3S50AN-5FTG256C | Same device, different speed grade | FTG256 | -5 | Commercial |
| XC3S50AN-4TQ144I | Same device, different package | TQ144 | -4 | Industrial |
| XC3S50AN-4TQG144C | Same device, different package | TQG144 | -4 | Commercial |
| XC3S50AN-4TQG144I | Same device, different package | TQG144 | -4 | Industrial |
| XC3S50AN-5TQG144C | Same device, different package | TQG144 | -5 | Commercial |
Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.
Frequently asked questions
- Is the XC3S50AN-4FTG256C still in production?
- The manufacturer has announced end of life for the XC3S50AN-4FTG256C. Request a quote to check remaining stock — send the quantity you need.
- What package is the XC3S50AN-4FTG256C?
- The XC3S50AN-4FTG256C comes in the FTG256 package (256-FTBGA, 17 × 17 mm).
- Which versions of the XC3S50AN come in industrial temperature?
- The XC3S50AN-4FTG256C is not an industrial-temperature part. 4 XC3S50AN parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S50AN-4FTG256IXC3S50AN-4FT256IXC3S50AN-4TQ144IXC3S50AN-4TQG144I
XC3S50AN discontinued?
We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.
XC3S50AN replacement optionsGuides and comparisons
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