FPGA Market

XC3S50AN-4FT256I

AMD Xilinx Spartan-3 FPGA

2K logic cells 256-ball Industrial

AvailableLifecycle: End of Life

The XC3S50AN-4FT256I is an AMD Xilinx Spartan-3 FPGA based on the XC3S50AN device, with 1,584 logic cells and 54 Kb of block RAM. It comes in the FT256 package (256-FTBGA, 17 × 17 mm), speed grade 4, industrial temperature (-40 °C to 100 °C, junction). The manufacturer has announced end of life for this part. Request a quote to check stock and pricing — include the quantity and any date-code or traceability requirements.

Logic cells
1,584
Block RAM
54 Kb
Pins
256
Speed grade
4
Temperature
Industrial

Part details

Manufacturer
AMD Xilinx
Part number
XC3S50AN-4FT256I
Base device
XC3S50AN
Family
Spartan-3
Package
FT256
Pin / ball count
256
Speed grade
4
Temperature grade
Industrial
Product status
End of Life
ECCN
EAR99
HTS code
8542.31.0060
RoHS
Not compliant

Device specifications

Logic cells
1,584
Block RAM
54 Kb

Specifications

Package outline
256-FTBGA, 17 × 17 mm
Package / case
256-LBGA
Mounting
Surface Mount
User I/O
195
LABs / CLBs
176
System gates
50,000
Supply voltage
1.14 V to 1.26 V
Operating temperature
-40 °C to 100 °C (junction)
Moisture sensitivity (MSL)
Level 3 (168 hours)
Series
Spartan-3AN
Last time buy
2 Sept 2014

Part number breakdown

SegmentFieldMeaning
XC3S50ANBase DeviceSpartan-3 device XC3S50AN
4Speed GradeSpeed grade 4
FT256Package256-pin BGA (thin fine-pitch ball grid array)
ITemperature GradeIndustrial

Documentation

Alternatives and other versions

Part numberHow it comparesPackageSpeedTemperature
XC3S50AN-4FT256CSame device, commercial temperatureFT256-4Commercial
XC3S50AN-5FT256CSame device, different speed and temperature gradeFT256-5Commercial
XC3S50AN-4FTG256CSame device, different packageFTG256-4Commercial
XC3S50AN-4FTG256ISame device, different packageFTG256-4Industrial
XC3S50AN-5FTG256CSame device, different packageFTG256-5Commercial
XC3S50AN-4TQ144ISame device, different packageTQ144-4Industrial
XC3S50AN-4TQG144CSame device, different packageTQG144-4Commercial
XC3S50AN-4TQG144ISame device, different packageTQG144-4Industrial
XC3S50AN-5TQG144CSame device, different packageTQG144-5Commercial

Ranked from manufacturer datasheets and pinout files. Customer approval still recommended.

Frequently asked questions

Is the XC3S50AN-4FT256I still in production?
The manufacturer has announced end of life for the XC3S50AN-4FT256I. Request a quote to check remaining stock — send the quantity you need.
What package is the XC3S50AN-4FT256I?
The XC3S50AN-4FT256I comes in the FT256 package (256-FTBGA, 17 × 17 mm).
Which versions of the XC3S50AN come in industrial temperature?
The XC3S50AN-4FT256I is itself an industrial-temperature part (-40 °C to 100 °C, junction). 3 other XC3S50AN parts are industrial temperature. A different speed grade or package is not a drop-in replacement, so check it against your design.XC3S50AN-4FTG256IXC3S50AN-4TQ144IXC3S50AN-4TQG144I

XC3S50AN discontinued?

We still source this part. If the design is being revised, the replacement page lists current AMD Xilinx devices of similar capacity.

XC3S50AN replacement options

Guides and comparisons

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